RF430CL331HIPWR datasheet(3/60 Pages) TI1

3 / 60 page

RF430CL331H

www.ti.com

SLASE18A – SEPTEMBER 2015 – REVISED NOVEMBER 2015

Table of Contents

Device Overview

......................................... 1

5.2

Functional Block Diagram

........................... 12

1.1

Features

.............................................. 1

5.3

Terms and Acronyms

............................... 12

1.2

Applications

........................................... 1

5.4

Serial Communication Interface

..................... 12

1.3

Description

............................................ 1

5.5

Communication Protocol

............................ 13

1.4

Typical Application

................................... 2

5.6

I2C Protocol

......................................... 13

Revision History

......................................... 3

5.7

NFC Type 4B Tag Platform

......................... 16

Terminal Configuration and Functions

.............. 4

5.8

NDEF Structure

..................................... 19

3.1

Pin Diagrams

......................................... 4

5.9

Typical Operation

.................................... 21

3.2

Pin Attributes

......................................... 5

5.10

RF Command Response Timing Limits

............. 33

3.3

Signal Descriptions

................................... 6

5.11

Registers

............................................ 35

3.4

Pin Multiplexing

....................................... 6

5.12

Identification

......................................... 48

3.5

Connections for Unused Pins

........................ 6

Applications, Implementation, and Layout

........ 49

Specifications

............................................ 7

6.1

Application Diagram

................................. 49

4.1

Absolute Maximum Ratings

.......................... 7

6.2

References

.......................................... 49

4.2

ESD Ratings

.......................................... 7

Device and Documentation Support

............... 50

4.3

Recommended Operating Conditions

................ 7

7.1

Device Support

...................................... 50

4.4

Recommended Operating Conditions, Resonant

7.2

Documentation Support

............................. 51

Circuit

................................................. 7

7.3

Community Resources

.............................. 51

4.5

Supply Currents

...................................... 8

7.4

Trademarks

.......................................... 51

4.6

Electrical Characteristics, Digital Inputs

.............. 8

7.5

Electrostatic Discharge Caution

..................... 52

4.7

Electrical Characteristics, Digital Outputs

............ 8

7.6

Export Control Notice

............................... 52

4.8

Thermal Characteristics

.............................. 9

7.7

Glossary

............................................. 52

4.9

Timing and Switching Characteristics

............... 10

Mechanical, Packaging, and Orderable

Detailed Description

................................... 12

Information

.............................................. 52

5.1

Overview

............................................ 12

Revision History

Changes from September 29, 2015 to November 30, 2015

Page

•

Deleted "Suggested to be set to 0x3B" from Step 7(a)

........................................................................ 34

•

Deleted "The recommended setting is maximum possible value, which is 0x3B" in the paragraph that starts

"When the internal state machine determines..."

................................................................................ 46

Revision History

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