TLE9263QX datasheet(10/164 Pages) INFINEON

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TLE9263QX

Pin Configuration

Data Sheet

Rev. 1.1, 2014-09-26

Note: all VS Pins must be connected to battery potential or insert a reverse polarity diodes where required;

all GND pins as well as the Cooling Tab must be connected to one common GND potential;

INT

Interrupt Output; used as wake-up flag for microcontroller in SBC Stop or Normal

Mode and for indicating failures. Active low.

During start-up used to set the SBC configuration. External pull-up sets config 1/3,

no external pull-up sets config 2/4.

Reset Output

TXDLIN1

Transmit LIN1

RXDLIN1

Receive LIN1

TXDCAN

Transmit CAN

RXDCAN

Receive CAN

VCAN

Supply Input; for internal HS-CAN cell

GND

CANL

CAN Low Bus Pin

CANH

CAN High Bus Pin

n.c.

not connected; internally not bonded.

LIN1

LIN1 Bus; Bus line for the LIN interface, according to ISO. 9141 and LIN

specification 2.2 as well as SAE J2602-2.

GND

Ground

LIN2

LIN2 Bus; Bus line for the LIN interface, according to ISO. 9141 and LIN

specification 2.2 as well as SAE J2602-2.

n.c.

not connected; internally not bonded.

n.c.

not connected; internally not bonded.

FO2

Fail Output 2 - Side Indicator; Side indicators 1.25Hz 50% duty cycle output;

Open drain. Active LOW.

Alternative Function: GPIO1; configurable pin as WK, or LS, or HS supplied by

VSHS (default is FO2, see also Chapter 14.1.1)

FO3/TEST

Fail Output 3 - Pulsed Light Output; Break/rear light 100Hz 20% duty cycle output;

Open drain. Active LOW

TEST; Connect to GND to activate SBC Software Development Mode;

Integrated pull-up resistor. Connect to VS with pull-up resistor or leave open for

normal operation.

Alternative Function: GPIO2; configurable pin as WK, or LS, or HS supplied by

VSHS (default is FO3, see also Chapter 14.1.1)

Cooling

Tab

GND

Cooling Tab - Exposed Die Pad; For cooling purposes only, do not use as an

electrical ground.1)

1) The exposed die pad at the bottom of the package allows better power dissipation of heat from the SBC via the PCB. The

exposed die pad is not connected to any active part of the IC an can be left floating or it can be connected to GND

(recommended) for the best EMC performance.

Symbol

Function

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