PIC17C752-08SLASHP datasheet(264/320 Pages) MICROCHIP

264 / 320 page

PIC17C75X

DS30264A-page 264

22.4

Package Marking Information

Legend:

MM...M

XX...X

Microchip part number information

Customer speciﬁc information*

Year code (last 2 digits of calender year)

Week code (week of January 1 is week '01’)

Facility code of the plant at which wafer is manufactured.

C = Chandler, Arizona, U.S.A.

Mask revision number for microcontroller

Assembly code of the plant or country of origin in which

part was assembled.

In the event the full Microchip part number cannot be marked on one

line, it will be carried over to the next line thus limiting the number of

available characters for customer speciﬁc information.

Note:

Standard OTP marking consists of Microchip part number, year code, week code,

facility code, mask revision number, and assembly code. For OTP marking beyond

this, certain price adders apply. Please check with your Microchip Sales Ofﬁce.

For QTP devices, any special marking adders are included in QTP price.

68-Lead PLCC

MMMMMMMMMM

MMMMMMM

AABBCDE

Example

S = Tempe, Arizona, U.S.A.

64-Lead TQFP

MMMMMMM

AABBCDE

MMMMMMMMMM

Example

9717CAE

68-Lead CERQUAD Windowed

Example

AABBCDE

64-Lead SDIP (Shrink DIP)

MMMMMMMMMMMMMMMMM

Example

PIC17C756

-08/L

9748CAE

MMMMMMMMMMMMMMMMM

AABBCDE

PIC17C756-04/CL

9750CAE

-08I/PT

PIC17C752

9736CAE

PIC17C752-04I/SP

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