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AN4209 bảng dữ liệu(PDF) 8 Page - STMicroelectronics

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STRVS parameters
AN4209
8/19
DocID023949 Rev 2
infrared camera and calculate the junction temperature using Equation 6. The lead is the
most interesting reference point to evaluate accurately the average operating junction
temperature Tjavg. The thermal resistance value Rth(j-l) depends only on the package
proprieties unlike Rth(j-a).
1.2.2
Transient parameter
Transient thermal impedance (ZTH(j-Ref)(tp))
The transient thermal impedance ZTH(j-Ref)(tp) is the temporary variation of thermal
resistance from an input power step function up to reaching a stable value as defined
Equation 7.
Equation 7
Transient thermal impedance can be calculated using Equation 8.
Equation 8
Where:
Junction to ambient, ZTH(j-a) and junction to lead, ZTH(j-l) transient thermal impedance
curves are provided in the datasheet. However ZTH(j-l) should be preferred to evaluate the
peak junction temperature to get a better assessment.
Thus from Equation 8, the dynamic change in temperature over the time can be determined
using
Equation 9
The transient thermal impedance diagram provides a quick and simple method to estimate
the rise of junction temperature under transient conditions. Figure 6 below illustrates
transient thermal impedance diagrams of the SMB package. Note that thermal impedances
increase until they reach their asymptotic limit corresponding to their thermal resistance
Rth(j-l) and Rth(j-a).
ZTH(j-Ref)
Junction to reference transient thermal impedance expressed in °C/W.
tp
Pulse duration of the step power expressed in s.
PStep
Step power function applied to the die expressed in W.
Tj(tp)
Junction temperature over the time width, expressed in °C.
TRef
Temperature of the reference point expressed in °C.
lim tp
Æ Zth(j-Ref) (tp) = Rth(j-Ref)
Step
f
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