TEF6894H datasheet(2/55 Pages) PHILIPS

2 / 55 page

2003 Oct 21

Philips Semiconductors

Product speciﬁcation

Car radio integrated signal processor

TEF6894H

CONTENTS

FEATURES

1.1

General

1.2

I2C-bus

1.3

Stereo decoder

1.4

Noise blanking

1.5

Weak signal processing

1.6

Tone/volume part

GENERAL DESCRIPTION

ORDERING INFORMATION

QUICK REFERENCE DATA

BLOCK DIAGRAM

PINNING

FUNCTIONAL DESCRIPTION

7.1

Stereo decoder

7.2

FM and AM noise blanker

7.3

High cut control and de-emphasis

7.4

Noise detector

7.4.1

FM noise detector

7.4.2

AM noise detector

7.5

Multipath/weak signal processing

7.6

Tone/volume control

7.6.1

Input selector

7.6.2

Loudness

7.6.3

Volume/balance

7.6.4

Treble

7.6.5

Bass

7.6.6

Fader/mute

7.6.7

Beep generator and NAV input with output

mixer

LIMITING VALUES

THERMAL CHARACTERISTICS

CHARACTERISTICS

I2C-BUS PROTOCOL

11.1

Read mode

11.1.1

Data byte 1; STATUS

11.1.2

Data byte 2; LEVEL

11.1.3

Data byte 3; USN and WAM

11.2

Write mode

11.2.1

Subaddress 2H; RDSCLK

11.2.2

Subaddress 4H; CONTROL

11.2.3

Subaddress 5H; CSALIGN

11.2.4

Subaddress 6H; MULTIPATH

11.2.5

Subaddress 7H; SNC

11.2.6

Subaddress 8H; HIGHCUT

11.2.7

Subaddress 9H; SOFTMUTE

11.2.8

Subaddress AH; RADIO

11.2.9

Subaddress BH; INPUT and ASI

11.2.10

Subaddress CH; LOUDNESS

11.2.11

Subaddress DH; VOLUME

11.2.12

Subaddress EH; TREBLE

11.2.13

Subaddress FH; BASS

11.2.14

Subaddress 10H; FADER

11.2.15

Subaddress 11H; BALANCE

11.2.16

Subaddress 12H; MIX

11.2.17

Subaddress 13H; BEEP

11.2.18

Subaddress 1FH; AUTOGATE

TEST AND APPLICATION INFORMATION

PACKAGE OUTLINE

SOLDERING

14.1

Introduction to soldering surface mount

packages

14.2

Reflow soldering

14.3

Wave soldering

14.4

Manual soldering

14.5

Suitability of surface mount IC packages for

wave and reflow soldering methods

DATA SHEET STATUS

DEFINITIONS

DISCLAIMERS

PURCHASE OF PHILIPS I2C COMPONENTS

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