W25X05CLZPIG datasheet(41/51 Pages) WINBOND

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W25X05CL/10CL/20CL

Publication Release Date: March 23, 2012

- 41 -

Revision B

AC Electrical Characteristics (cont’d)

DESCRIPTION

SYMBOL

ALT

SPEC

UNIT

MIN

TYP

MAX

Output Hold Time

tCLQX

tHO

/HOLD Active Setup Time relative to CLK

tHLCH

/HOLD Active Hold Time relative to CLK

tCHHH

/HOLD Not Active Setup Time relative to CLK

tHHCH

/HOLD Not Active Hold Time relative to CLK

tCHHL

/HOLD to Output Low-Z

tHHQX(2)

tLZ

/HOLD to Output High-Z

tHLQZ(2)

tHZ

Write Protect Setup Time Before /CS Low

tWHSL(3)

Write Protect Hold Time After /CS High

tSHWL(3)

100

/CS High to Power-down Mode

tDP(2)

µs

/CS High to Standby Mode without Electronic

Signature Read

tRES1(2)

µs

/CS High to Standby Mode with Electronic

Signature Read

tRES2(2)

1.8

µs

Write Status Register Time

Byte Program Time (First Byte) (4)

tBP1

µs

Additional Byte Program Time (After First Byte) (4)

tBP2

2.5

µs

Page Program Time

tPP

0.4

0.8

Sector Erase Time (4KB)

tSE

300

Block Erase Time (32KB)

tBE1

120

800

Block Erase Time (64KB)

tBE2

150

1,000

Chip Erase Time W25X20CL

tCE

0.5

Chip Erase Time W25X10CL & W25X05CL

tCE

0.25

Notes:

Clock high + Clock low must be less than or equal to 1/fC.

Value guaranteed by design and/or characterization, not 100% tested in production.

Only applicable as a constraint for a Write Status Register instruction when SRP is set to 1.

For multiple bytes after first byte within a page, tBPN = tBP1 + tBP2 * N (typical) and tBPN = tBP1 + tBP2 * N (max), where N = number

of bytes programmed.

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