TMS320DM6467CCUT6 datasheet(6/355 Pages) TI1

6 / 355 page

TMS320DM6467

SPRS403H – DECEMBER 2007 – REVISED JUNE 2012

www.ti.com

7.2

Recommended Clock and Control Signal Transition

Digital Media System-on-Chip (DMSoC)

............ 1

Behavior

........................................... 143

1.1

Features

............................................. 1

7.3

Power Supplies

.................................... 144

1.2

Description

........................................... 3

7.4

External Clock Input From DEV_MXI/DEV_CLKIN

1.3

Functional Block Diagram

........................... 5

and AUX_MXI/AUX_CLKIN Pins

.................. 153

Revision History

........................................ 7

7.5

Clock PLLs

........................................ 156

Device Overview

........................................ 7

7.6

Enhanced Direct Memory Access (EDMA3)

3.1

Device Characteristics

............................... 7

Controller

.......................................... 164

3.2

Device Compatibility

................................ 10

7.7

Reset

.............................................. 184

3.3

ARM Subsystem

.................................... 10

7.8

Interrupts

.......................................... 195

3.4

DSP Subsystem

.................................... 14

7.9

External Memory Interface (EMIF)

................ 201

3.5

Memory Map Summary

............................ 19

7.10

DDR2 Memory Controller

......................... 208

3.6

Pin Assignments

.................................... 23

7.11

Video Port Interface (VPIF)

....................... 221

3.7

Terminal Functions

................................. 29

7.12

Transport Stream Interface (TSIF)

................ 229

3.8

Device Support

..................................... 80

7.13

Clock Recovery Generator (CRGEN)

............. 239

3.9

Documentation Support

............................ 82

7.14

Video Data Conversion Engine (VDCE)

.......... 242

3.10

Community Resources

............................. 82

7.15

Peripheral Component Interconnect (PCI)

........ 245

Device Configurations

................................ 84

7.16

Ethernet MAC (EMAC)

............................ 251

4.1

System Module Registers

.......................... 84

7.17

Management Data Input/Output (MDIO)

.......... 261

4.2

Power Considerations

.............................. 86

7.18

Host-Port Interface (HPI) Peripheral

.............. 263

4.3

Clock Considerations

............................... 89

7.19

USB 2.0

........................................... 271

4.4

Boot Sequence

..................................... 96

7.20

ATA Controller

..................................... 281

4.5

Configurations At Reset

........................... 102

7.21

VLYNQ

............................................ 296

4.6

Configurations After Reset

........................ 105

7.22

Multichannel Audio Serial Port (McASP0/1)

Peripherals

........................................ 301

4.7

Multiplexed Pin Configurations

.................... 113

7.23

Serial Peripheral Interface (SPI)

.................. 313

4.8

Debugging Considerations

........................ 136

7.24

Universal Asynchronouse Receiver/Transmitter

System Interconnect

................................ 138

(UART)

............................................ 328

Device Operating Conditions

...................... 139

7.25

Inter-Integrated Circuit (I2C)

...................... 335

6.1

Absolute Maximum Ratings Over Operating Case

7.26

Pulse Width Modulator (PWM)

.................... 339

Temperature Range (Unless Otherwise Noted)

.. 139

7.27

Timers

............................................. 341

6.2

Recommended Operating Conditions

............. 140

7.28

General-Purpose Input/Output (GPIO)

............ 344

6.3

Electrical Characteristics Over Recommended

Ranges of Supply Voltage and Operating

7.29

IEEE 1149.1 JTAG

................................ 347

Temperature (Unless Otherwise Noted)

.......... 141

Mechanical Packaging and Orderable

Peripheral Information and Electrical

Information

............................................ 350

Specifications

......................................... 142

8.1

Thermal Data for CUT

............................ 350

7.1

Parameter Information

............................ 142

8.2

Packaging Information

............................ 350

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