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MPC8241EC bảng dữ liệu(PDF) 50 Page - Freescale Semiconductor, Inc |
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MPC8241EC bảng dữ liệu(HTML) 50 Page - Freescale Semiconductor, Inc |
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50 / 58 page ![]() MPC8241 Integrated Processor Hardware Specifications, Rev. 10 50 Freescale Semiconductor System Design Information Figure 31. Thermal Performance of Select Thermal Interface Material The board designer can choose among several types of thermal interface. Heat sink adhesive materials are selected on the basis of high conductivity and adequate mechanical strength to meet equipment shock/vibration requirements. Several commercially-available thermal interfaces and adhesive materials are provided by the following vendors: The Bergquist Company 800-347-4572 18930 West 78th St. Chanhassen, MN 55317 Internet: www.bergquistcompany.com Chomerics, Inc. 781-935-4850 77 Dragon Ct. Woburn, MA 01888-4014 Internet: www.chomerics.com Dow-Corning Corporation 800-248-2481 Dow-Corning Electronic Materials 2200 W. Salzburg Rd. Midland, MI 48686-0997 Internet: www.dow.com 0 0.5 1 1.5 2 0 1020304050607080 Silicone Sheet (0.006 in.) Bare Joint Floroether Oil Sheet (0.007 in.) Graphite/Oil Sheet (0.005 in.) Synthetic Grease Contact Pressure (psi) |
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