MPC8241EC datasheet(48/58 Pages) FREESCALE

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MPC8241 Integrated Processor Hardware Specifications, Rev. 10

Freescale Semiconductor

System Design Information

Figure 29. Die Junction-to-Ambient Resistance

The board designer can choose among several types of heat sinks to place on the MPC8241. Several

commercially available heat sinks for the MPC8241 are provided by the following vendors:

Aavid Thermalloy

603-224-9988

80 Commercial St.

Concord, NH 03301

Internet: www.aavidthermalloy.com

Alpha Novatech

408-749-7601

473 Sapena Ct. #15

Santa Clara, CA 95054

Internet: www.alphanovatech.com

International Electronic Research Corporation (IERC) 818-842-7277

413 North Moss St.

Burbank, CA 91502

Internet: www.ctscorp.com

Tyco Electronics

800-522-6752

Chip Coolers™

P.O. Box 3668

Harrisburg, PA 17105-3668

Internet: www.chipcoolers.com

Wakefield Engineering

603-635-5102

33 Bridge St.

Pelham, NH 03076

Internet: www.wakefield.com

Selection of an appropriate heat sink depends on thermal performance at a given air velocity, spatial

volume, mass, attachment method, assembly, and cost. Other heat sinks offered by Aavid Thermalloy,

Alpha Novatech, IERC, Chip Coolers, and Wakefield Engineering offer different heat sink-to-ambient

thermal resistances, and may or may not need airflow.

0.0

10.0

20.0

30.0

40.0

50.0

00.5

1.5

22.5

Airflow V elocity (m/s)

2s2p

1s/s ink

2s2p/s ink

Airflow Velocity (m/s)

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