MPC8241EC datasheet(47/58 Pages) FREESCALE

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MPC8241 Integrated Processor Hardware Specifications, Rev. 10

Freescale Semiconductor

System Design Information

7.7

Thermal Management

This section provides thermal management information for the plastic ball grid array (PBGA) package for

air-cooled applications. Depending on the application environment and the operating frequency, a heat

sink may be required to maintain junction temperature within specifications. Proper thermal control design

primarily depends on the system-level design: heat sink, airflow, and thermal interface material. To reduce

the die-junction temperature, heat sinks can be attached to the package by several methods: adhesive,

spring clip to holes in the printed-circuit board or package, or mounting clip and screw assembly (see

Figure 28).

Figure 28. Package Exploded Cross-Sectional View with Several Heat Sink Options

Figure 29 depicts the die junction-to-ambient thermal resistance for four typical cases:

•

A heat sink is not attached to the PBGA package and a high board-level thermal loading from

adjacent components exists (label used—1s).

•

A heat sink is not attached to the PBGA package and a low board-level thermal loading from

adjacent components exists (label used—2s2p).

•

A large heat sink (cross cut extrusion, 38

× 38 × 16.5 mm) is attached to the PBGA package and a

high board-level thermal loading from adjacent components exists (label used—1s/sink).

•

A large heat sink (cross cut extrusion, 38

× 38 × 16.5 mm) is attached to the PBGA package and a

low board-level thermal loading from adjacent components exists (label used—2s2p/sink).

Adhesive or

Thermal Interface

Heat Sink

PBGA Package

Heat Sink

Clip

Printed-Circuit Board

Option

Material

Die

Wire

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