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dsPIC33FJ64GS406 bảng dữ liệu(PDF) 366 Page - Microchip Technology |
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dsPIC33FJ64GS406 bảng dữ liệu(HTML) 366 Page - Microchip Technology |
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366 / 456 page ![]() dsPIC33FJ32GS406/606/608/610 and dsPIC33FJ64GS406/606/608/610 DS70591E-page 366 2009-2012 Microchip Technology Inc. 27.1 DC Characteristics TABLE 27-1: OPERATING MIPS vs. VOLTAGE Characteristic VDD Range (in Volts) Temp Range (in °C) Max MIPS dsPIC33FJ32GS406/606/608/610 and dsPIC33FJ64GS406/606/608/610 — 3.0-3.6V(1) -40°C to +85°C 40 — 3.0-3.6V(1) -40°C to +125°C 40 Note 1: Overall functional device operation at VBORMIN < VDD < VDDMIN is tested but not characterized. All device analog modules, such as the ADC, etc., will function but with degraded performance below VDDMIN. See Parameter BO10 in Table 27-11 for the BOR values. TABLE 27-2: THERMAL OPERATING CONDITIONS Rating Symbol Min Typ Max Unit Industrial Temperature Devices Operating Junction Temperature Range TJ -40 — +125 °C Operating Ambient Temperature Range TA -40 — +85 °C Extended Temperature Devices Operating Junction Temperature Range TJ -40 — +140 °C Operating Ambient Temperature Range TA -40 — +125 °C Power Dissipation: Internal Chip Power Dissipation: PINT = VDD x (IDD – IOH) PD PINT + PI/O W I/O Pin Power Dissipation: I/O = ({VDD – VOH} x IOH) + (VOL x IOL) Maximum Allowed Power Dissipation PDMAX (TJ – TA)/ JA W TABLE 27-3: THERMAL PACKAGING CHARACTERISTICS Characteristic Symbol Typ Max Unit Notes Package Thermal Resistance, 64-Pin QFN (9x9x0.9 mm) JA 28 — °C/W 1 Package Thermal Resistance, 64-Pin TQFP (10x10x1 mm) JA 39 — °C/W 1 Package Thermal Resistance, 80-Pin TQFP (12x12x1 mm) JA 53.1 — °C/W 1 Package Thermal Resistance, 100-Pin TQFP (12x12x1 mm) JA 43 — °C/W 1 Package Thermal Resistance, 100-Pin TQFP (14x14x1 mm) JA 43 — °C/W 1 Note 1: Junction to ambient thermal resistance, Theta-JA ( JA) numbers are achieved by package simulations. |
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