OR2C04A datasheet(128/192 Pages) ETC

128 / 192 page

Data Sheet

ORCA Series 2 FPGAs

June 1999

128

Lucent Technologies Inc.

Package Parasitics (continued)

These parameters are important in determining ground bounce noise and inductive crosstalk noise. Three capaci-

tances in pF are listed: CM, the mutual capacitance of the lead to the nearest neighbor lead; and C1 and C2, the

total capacitance of the lead to all other leads (all other leads are assumed to be grounded). These parameters are

important in determining capacitive crosstalk and the capacitive loading effect of the lead.

The parasitic values in Table 30 are for the circuit model of bond wire and package lead parasitics. If the mutual

capacitance value is not used in the designer’s model, then the value listed as mutual capacitance should be added

to each of the C1 and C2 capacitors.

5-3862(F).r2

Figure 53. Package Parasitics

Table 30. Series 2 Package Parasitics

Package Type

LSW

LMW

LSL

LML

84-Pin PLCC

140

0.5

7—11

3—6

100-Pin TQFP

150

0.5

0.4

4—6

2—3

144-Pin TQFP

140

0.6

4—6

2—2.5

160-Pin QFP

1.5

180

1.5

10—13

6—8

208-Pin SQFP

200

7—10

4—6

208-Pin SQFP2

200

6—9

4—6

240-Pin SQFP

200

8—12

5—8

240-Pin SQFP2

200

7—11

4—7

256-Pin PBGA

220

5—8

2—4

304-Pin SQFP

220

12—18

7—12

304-Pin SQFP2

220

11—17

7—12

352-Pin PBGA

220

1.5

7—12

3—6

432-Pin EBGA

1.5

500

0.3

3—5.5

0.5—1

PAD N

CIRCUIT

BOARD PAD

LMW

LML

PAD N + 1

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