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TPD1039F bảng dữ liệu(PDF) 3 Page - Toshiba Semiconductor |
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TPD1039F bảng dữ liệu(HTML) 3 Page - Toshiba Semiconductor |
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3 / 10 page ![]() TPD1039F 2008-03-18 3 Absolute Maximum Ratings (Ta = 25°C) Characteristics Symbol Rating Unit Drain-source voltage VDS (DC) 45 V Drain current ID (DC) 1.5 A Input voltage VIN −0.5 to 6 V Power dissipation (Note 2-a) PD(1) 1.1 W Power dissipation (Note 2-b) PD(2) 0.425 W Single pulse active clamp capability (Note 3) EAS 20 mJ Active clamp current IAR 1.5 A Repetitive active clamp capability (Note 2-a) (Note 4) EAR 0.11 mJ Operating temperature Topr −40 to 85 °C Channel temperature Tch 150 (Note 5) °C Storage temperature Tstg −55 to 150 °C Note 1: Using continuously under heavy loads (e.g. the application of high temperature/current/voltage and the significant change in temperature, etc.) may cause this product to decrease in the reliability significantly even if the operating conditions (i.e. operating temperature/current/voltage, etc.) are within the absolute maximum ratings and the operating ranges. Please design the appropriate reliability upon reviewing the Toshiba Semiconductor Reliability Handbook (“Handling Precautions”/“Derating Concept and Methods”) and individual reliability data (i.e. reliability test report and estimated failure rate, etc). Thermal Characteristics Characteristics Symbol Rating Unit 113.5 (Note 2-a) Thermal resistance, channel to ambient Rth(ch-a) 294.0 (Note 2-b) °C /W Note 2: 2-a: glass epoxy board (a) 2-b: glass epoxy board (b ) Note 3: Active clamp capability (single pulse) test condition VDD = 25 V, Tch = 25°C (initial), L = 10 mH, IAR = 1.5 A, RG = 25Ω Note 4: Repetitive rating: Pulse width limited by maximum channel temperature Note 5: Overtemperature protection is tripped at a channel temperature of 125°C. Ensure that the channel temperature, Tch, does not exceed 125°C under the worst-case conditions. FR-4 25.4×25.4×0.8 (unit: mm) FR-4 25.4×25.4×0.8 (unit: mm) |
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