TMS320TCI100QGLZ datasheet(63/137 Pages) TI1

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TMS320TCI100Q

FIXEDPOINT DIGITAL SIGNAL PROCESSOR

SPRS251E − JUNE 2004 − REVISED JUNE 2006

POST OFFICE BOX 1443

• HOUSTON, TEXAS 77251−1443

device and development-support tool nomenclature (continued)

C64xDSP

TCI100Q

PREFIX

TMS

320

TCI100Q GLZ

TMX = Experimental device

TMP = Prototype device

TMS = Qualified device

DEVICE FAMILY

320 or 32 or 3

= TMS320

t DSP family

PACKAGE TYPE#||§

GLZ = 532-pin plastic BGA, with solder package balls

ZLZ = 532-pin plastic BGA, with Pb−free package balls

CLZ = Pb−Free die bump and solder ball version of GLZ

and ZLZ

DEVICE¶

† See the Recommended Operating Conditions section of this data sheet for more details.

‡ The extended temperature “A version” devices may have different operating conditions than the commercial temperature devices.

§ BGA = Ball Grid Array

¶ For the actual device part numbers (P/Ns) and ordering information, see the TI website (www.ti.com).

# The ZLZ mechanical package designator represents the version of the GLZ with Pb−Free package balls.

|| The CLZ mechanical package designator represents the version of the GLZ and ZLZ with Pb−Free die bump and solder balls.

TEMPERATURE RANGE (DEFAULT: 0

°C TO 90°C)†‡

( )

Blank = 0

°C to 90°C, commercial temperature

= −40

°C to 105°C, extended temperature

Figure 5. TMS320C64x

 DSP Device Nomenclature (Including the TCI100Q Device)

For additional information, see the TMS320TCI100Q Digital Signal Processor Silicon Errata (literature number

SPRZ229).

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