ADSP-BF607 datasheet(43/44 Pages) AD

43 / 44 page

Preliminary Technical Data

Rev. PrD

Page 43 of 44

March 2012

ADSP-BF606/ADSP-BF607/ADSP-BF608/ADSP-BF609

AUTOMOTIVE PRODUCTS

The TBD model is available with controlled manufacturing to

support the quality and reliability requirements of automotive

applications. Note that these automotive models may have spec-

ifications that differ from the commercial models and designers

should review the product specifications section of this data

sheet carefully. Only the automotive grade products shown in

below are available for use in automotive applications. Contact

your local ADI account representative for specific product

ordering information and to obtain the specific Automotive

Reliability reports for these models.

PRE RELEASE PRODUCTS

Model

Temperature

Range1

Package Description

Package

Option

Processor Instruction

Rate (Max)

TBD

349-Ball Chip Scale Package Ball

Grid Array

BC-349-1

500 MHz

1 Referenced temperature is ambient temperature. The ambient temperature is not a specification. Please see Operating Conditions on Page 31 for the junction temperature

(TJ) specification which is the only temperature specification.

Model

Temperature

Range1

1 Referenced temperature is ambient temperature. The ambient temperature is not a specification. Please see Operating Conditions on Page 31 for the junction temperature

(TJ) specification which is the only temperature specification.

Package Description

Package

Option

Processor Instruction

Rate (Max)

ADSP-BF609-ENG

TBD

349-Ball Chip Scale Package Ball

Grid Array

BC-349-1

500 MHz

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