TMP320C6720RFP300 datasheet(110/118 Pages) TI

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7.2 Supplementary Information About the 144-Pin RFP PowerPAD™ Package

7.2.1

Standoff Height

7.3 Packaging Information

TMS320C6727B, TMS320C6726B, TMS320C6722B, TMS320C6720

Floating-Point Digital Signal Processors

SPRS370E – SEPTEMBER 2006 – REVISED JULY 2008

www.ti.com

This section highlights a few important details about the 144-pin RFP PowerPAD™ package. Texas

Instruments' PowerPAD Thermally Enhanced Package Technical Brief (literature number SLMA002)

should be consulted before designing a PCB for this device.

As illustrated in Figure 7-1, the standoff height specification for this device (between 0.050 mm and

0.150 mm) is measured from the seating plane established by the three lowest package pins to the lowest

point on the package body. Due to warpage, the lowest point on the package body is located in the center

of the package at the exposed thermal pad.

Using this definition of standoff height provides the correct result for determining the correct solder paste

thickness. According to TI's PowerPAD Thermally Enhanced Package Technical Brief (literature number

SLMA002), the recommended range of solder paste thickness for this package is between 0.152 mm and

0.178 mm.

Figure 7-1. Standoff Height Measurement on 144-Pin RFP Package

The following packaging information reflects the most current released data available for the designated

device(s). This data is subject to change without notice and without revision of this document.

On the 144-pin RFP package, the actual size of the Thermal Pad is 5.4 mm

× 5.4 mm.

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Mechanical Data

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