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SE97BTP bảng dữ liệu(PDF) 49 Page - NXP Semiconductors |
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SE97BTP bảng dữ liệu(HTML) 49 Page - NXP Semiconductors |
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49 / 53 page ![]() SE97B_1 © NXP B.V. 2010. All rights reserved. Product data sheet Rev. 01 — 27 January 2010 49 of 53 NXP Semiconductors SE97B DDR memory module temp sensor with integrated SPD For further information on temperature profiles, refer to Application Note AN10365 “Surface mount reflow soldering description”. 14. Abbreviations MSL: Moisture Sensitivity Level Fig 42. Temperature profiles for large and small components 001aac844 temperature time minimum peak temperature = minimum soldering temperature maximum peak temperature = MSL limit, damage level peak temperature Table 35. Abbreviations Acronym Description ADC A-to-D Converter ARA Alert Response Address CDM Charged Device Model CPU Central Processing Unit DDR Double Data Rate DIMM Dual In-line Memory Module DRAM Dynamic Random Access Memory EEPROM Electrically Erasable Programmable Read-Only Memory ESD ElectroStatic Discharge HBM Human Body Model I2C-bus Inter-Integrated Circuit bus LSB Least Significant Bit MM Machine Model MSB Most Significant Bit PC Personal Computer PCB Printed-Circuit Board POR Power-On Reset |
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