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SE97BTP bảng dữ liệu(PDF) 36 Page - NXP Semiconductors

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SE97B_1
© NXP B.V. 2010. All rights reserved.
Product data sheet
Rev. 01 — 27 January 2010
36 of 53
NXP Semiconductors
SE97B
DDR memory module temp sensor with integrated SPD
9.1 SE97B in memory module application
Figure 21 shows the SE97B being placed in the memory module application. The SE97B
is centered in the memory module to monitor the temperature of the DRAM and also to
provide a 2-kbit EEPROM as the Serial Presence Detect (SPD). In the event of
overheating, the SE97B triggers the EVENT output and the memory controller throttles
the memory bus to slow the DRAM. The memory controller can also read the SE97B and
watch the DRAM thermal behavior, taking preventive measures when necessary.
9.2 Layout consideration
The SE97B does not require any additional components other than the host controller to
read its temperature. It is recommended that a 0.1
μF bypass capacitor between the V
DD
and VSS pins is located as close as possible to the power and ground pins for noise
protection.
9.3 Thermal considerations
In general, self-heating is the result of power consumption and not a concern, especially
with the SE97B, which consumes very low power. In the event the SDA and EVENT pins
are heavily loaded with small pull-up resistor values, self-heating affects temperature
accuracy by approximately 0.5
°C.
Equation 1 is the formula to calculate the effect of self-heating:
(1)
where:
ΔT = T
j − Tamb
Tj = junction temperature
Tamb = ambient temperature
Rth(j-a) = package thermal resistance
VDD = supply voltage
IDD(AV) = average supply current
Fig 21. System application
002aae315
SE97B
EVENT
DIMM
DRAM
DRAM
DRAM
DRAM
MEMORY CONTROLLER
SMBus
CPU
ΔTR
th j-a
()
V
DD
I
DD AV
()
×
()
V
OL SDA
()
I
OL
k
sin
() SDA
()
×
()
V
OL EVENT
()
I
OL
k
sin
()EVENT
×
()
++
[
]
×
=



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