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HB2000ES bảng dữ liệu(PDF) 30 Page - NXP Semiconductors |
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HB2000ES bảng dữ liệu(HTML) 30 Page - NXP Semiconductors |
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30 / 34 page ![]() NXP Semiconductors KTFRDMHB2000ESEVMUG FRDM-HB2000ESEVM evaluation board KTFRDMHB2000ESEVMUG All information provided in this document is subject to legal disclaimers. © NXP B.V. 2018. All rights reserved. User guide Rev. 2 — 11 June 2018 30 / 34 Item Qty Schematic label Value Description Part number Assy opt Switches, connectors, jumpers, and test points[1] 21 18 IN1, GND1, IN2, GND2, GND3, VPWR, VDDQ, VDD, SCLK, MOSI, MISO, GND, FS_B, ENBL, DIS, CS_B, CFB_V, CCP TEST POINT BLACK 40 MIL DRILL 180 MIL TH 109L 5001 22 10 J1, J2, J3, J4, J5, J6, J7, J8, J14, J17 HDR 1X3 TH 100 MIL SP 374H AU 826629-3 23 1 J10 HDR 2X10 TH 100 MIL CTR 330H AU 100L TSW-110-07-S-D 24 5 J11, J15, J18, J19, J26 HDR 1X2 TH 100 MIL SP 378H AU 130L 826629-2 25 2 J20, J21 CON 1X2 TB TH 5.08 MM 543H SN 138L 20020316-H021B01LF 26 1 J23 HDR 2X6 TH 100 MIL CTR 330H AU TSW-106-07-S-D 27 2 J24, J25 HDR 2X8 TH 100 MIL CTR 330H AU TSW-108-07-G-D 28 1 Q1 TRAN NMOS PWR 30 A 55 V AEC‑Q101 TO252 IPD30N06S2-15 29 1 Q3 TRAN NPN DRIVER 500 mA 80 V AEC‑Q101 SOT23 SMMBTA06LT1G [1] NXP does not assume liability, endorse, or warrant components from external manufacturers are referenced in circuit drawings or tables. While NXP offers component recommendations in this configuration, it is the responsibility of the customer to validate their application. [2] Critical components. For critical components, it is vital to use the manufacturer listed. 10 Accessory item bill of materials Table 13. Accessory item bill of materials Item Qty Part Number Description 1 1 FRDM-KL25Z[1] NXP Freedom development platform for Kinetis KL14, KL15, KL24, KL25 MCUs [1] NXP does not assume liability, endorse, or warrant components from external manufacturers are referenced in circuit drawings or tables. While NXP offers component recommendations in this configuration, it is the responsibility of the customer to validate their application. |
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