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db09284e_V3.01_preliminary_2017-07-06

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AS89020

V3.01

IPC/JEDEC J-STD-020D.1

(Pb-Free)

RECOMMENDED

DATA

Average ramp-down rate [°C/s]

(Peak temperature to 200°C)

max. 6.0

3.0

Time [s] from 25°C to peak temperature

max. 480

350

Figure 14: recommend soldering profile

Do not to exceed the recommended values. For further information see JEDEC J-STD-020D.1.

9 APPLICATION NOTES

Figure 15 shows typical connections of external devices to the AS89020. If digital and analog grounds are

routed separately onto the printed circuit board, they should be connected together near the device.

Figure 15: Typical Connection Circuitry – (a) Common Cathode Photodiode Array (CREG:DIR = ,1b’), (b) Common Anode

Photodiode Array (CREG:DIR = ,0b’)

(a)

(b)

Please make sure that all specified components within your application circuit operate according to their

working range and to the parameters in the data sheet. For example, photodiode sensor (input current)

and voltage regulators (workspace load current, separated analog and digital or decoupled power supplies

based on a common regulator) need special treatment to avoid noise or deviations during operation.

Time 25 °C To Peak

tS

Time →

TL

TP

25

Tsmin

Tsmax

tL

Preheat Area

Max. Ramp Up Rate = 3 °C/s

Max. Ramp Down Rate = 6 °C/s

tP

TC –5 °C

Supplier tP

Supplier TP ≥ TC

User tP

User TP ≤ TC

TC

TC –5 °C