6 Specifications

6.1 Absolute Maximum Ratings

Over free-air temperature range unless otherwise noted(1)

MIN

MAX

UNIT

Supply voltage

V+

TMP112-Q1

4

V

TMP112D-Q1

-0.3

6

Input/Output Voltage

SCL, ADD0, and SDA

TMP112-Q1

–0.5

4

V

TMP112D-Q1

-0.3

6

ALERT

TMP112-Q1

–0.5

((V+) + 0.3)

and ≤ 4

TMP112D-Q1

-0.3

6

Output Current

Output Current

±10

mA

Operating temperature

–40

125

°C

Junction temperature, TJ

150

°C

Storage temperature, Tstg

–60

150

°C

(1)

Operation outside the Absolute Maximum Ratings may cause permanent device damage. Absolute Maximum Ratings do not imply

functional operation of the device at these or any other conditions beyond those listed under Recommended Operating Conditions.

If used outside the Recommended Operating Conditions but within the Absolute Maximum Ratings, the device may not be fully

functional, and this may affect device reliability, functionality, performance, and shorten the device lifetime.

6.2 ESD Ratings

VALUE

UNIT

V(ESD)

Electrostatic discharge

Human body model (HBM), per AEC Q100-002(1)

±2000

V

Charged device model (CDM), per AEC Q100-011

±1000

(1)

AEC Q100-002 indicates HBM stressing is done in accordance with the ANSI/ESDA/JEDEC JS-001 specification.

6.3 Recommended Operating Conditions

Over operating free-air temperature range (unless otherwise noted)

MIN

NOM

MAX

UNIT

V+

Supply voltage

1.4

3.3

3.6

V

TA

Operating free-air temperature

–40

125

°C

6.4 Thermal Information

THERMAL METRIC(1)

TMP112-Q1

TMP112D-Q1

UNIT

DRL (SOT563)

DRL (SOT563)

DPW (X2SON)

6 PINS

6 PINS

5 PINS

RθJA

Junction-to-ambient thermal resistance

210.3

240.2

230

°C/W

RθJC(top)

Junction-to-case (top) thermal resistance

105.0

96.4

194

°C/W

RθJB

Junction-to-board thermal resistance

87.5

124.3

158.4

°C/W

ψJT

Junction-to-top characterization parameter

6.1

4.0

20

°C/W

ψJB

Junction-to-board characterization parameter

87.0

123.1

158.3

°C/W

RθJC(bot)

Junction-to-case (bottom) thermal resistance

N/A

N/A

108.4

°C/W

MT

Thermal Mass

-

1.97

0.46

mJ/°C

(1)

For more information about traditional and new thermal metrics, see the IC Package Thermal Metrics application note, SPRA953.

TMP112-Q1, TMP112D-Q1

SLOS887G – SEPTEMBER 2014 – REVISED MAY 2025

www.ti.com

6

Submit Document Feedback

Copyright © 2025 Texas Instruments Incorporated

Product Folder Links: TMP112-Q1 TMP112D-Q1