TMP112 datasheet(33/46 Pages) TI2

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8.2.1 Design Requirements

The TMP112-Q1/TMP112D-Q1 device requires pullup resistors on the SCL, SDA, and/or ALERT pins. The

recommended value for the pullup resistors is 5kΩ. In some applications the pullup resistor can be lower or

higher than 5kΩ but must not exceed 3mA of current on any of those pins. A 0.01μF bypass capacitor on the

supply is recommended as shown in Figure 8-3 and Figure 8-4. The SCL and SDA lines can be pulled up to a

supply that is equal to or higher than V+ through the pullup resistors. To configure one of four different addresses

on the bus, connect the ADD0 pin to either the GND, V+, SDA, or SCL pin.

8.2.2 Detailed Design Procedure

Place the TMP112-Q1/TMP112D-Q1 device in close proximity to the heat source that must be monitored, with a

proper layout for good thermal coupling. This placement verifies that temperature changes are captured within

the shortest possible time interval. To maintain accuracy in applications that require air or surface temperature

measurement, care must be taken to isolate the package and leads from ambient air temperature. A thermally-

conductive adhesive is helpful in achieving accurate surface temperature measurement.

The TMP112-Q1/TMP112D-Q1 device is a very low-power device and generates very low noise on the supply

bus. Applying an RC filter to the V+ pin of the TMP112-Q1/TMP112D-Q1 device can further reduce any noise

that the TMP112-Q1/TMP112D-Q1 device can propagate to other components. R(F) in Figure 8-5 must be less

than 5kΩ and C(F) must be greater than 10nF.

Device

SCL

SDA

GND

V+

ALERT

ADD0

(F)

10nF

≥

(F)

5kΩ

≤

Supply Voltage

Figure 8-5. Noise Reduction Techniques (for SOT563-6 Package as an Example)

8.2.3 Application Curve

Figure 8-6 shows the step response of the TMP112-Q1/TMP112D-Q1 device to a submersion in an oil bath of

100°C from room temperature (27°C). The time-constant, or the time for the output to reach 63% of the input

step, is 1.2s for both packages. The time-constant result depends on the printed circuit board (PCB) that the

TMP112-Q1/TMP112D-Q1 device is mounted. For this test, the TMP112-Q1/TMP112D-Q1 device is soldered to

a two-layer PCB that measured 0.5 inches × 0.5 inches.

www.ti.com

TMP112-Q1, TMP112D-Q1

SLOS887G – SEPTEMBER 2014 – REVISED MAY 2025

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