SPSB100 datasheet(9/213 Pages) STMICROELECTRONICS

9 / 213 page

Symbol

Parameter

Condition

Min Typ Max Unit

ISGND

Maximum current at SGND(3)

-1.25

1.25

IVIN12

Maximum current at VIN12(3) (x 2)

-5

IPGND1, IPGND2 Maximum current at PGND1 and 2(3) (x 2)

-5

IPH1, IPH2

Maximum current at PH1 and 2(3) (x 2)

-5

IVIN3

Maximum current at VIN3(3) (x 3)

-5

IPGND3

Maximum current at PGND3(3) (x 3)

-5

IPH3

Maximum current at PH3(3) (x 4)

-5

VPGND

PGND versus GND

-0.3

0.3

VGND

SGND versus GND

-0.3

0.3

1. Transients on this pin can be tolerated for a duration < 100 ns, not exceeding -3 V.

2. Guaranteed by design.

3. Values for the absolute maximum DC current through the bond wires. This value does not consider maximum power

dissipation or other limits. Guaranteed by design.

2.3

ESD robustness

Table 4. ESD protection

Symbol

Parameter

Condition

Min

Typ

Max

Unit

Pins

All pins

HBM(1)

-2

Power output pin

OUT_HS

HBM(2)

-4

Pins(3)

All pins

CDM (values for corner pins in brackets)

-500/(-750)

500/(750)

1. HBM (human body model, 100 pF, 1.5 kΩ) according to the AEC-Q100-0022.

2. HBM with all none zapped pins grounded.

3. CDM (charged device model) according to the AEC-Q100-011.

2.4

Temperature ranges and thermal data

Table 5. Temperature ranges and thermal data

Symbol

Parameter

Condition

Min

Typ

Max

Unit

Tamb

Operating temperature (ECU environment)

-40

125

°C

Operating junction temperature

-40

175

°C

Tstg

Storage temperature

-55

150

°C

TW (1)

Thermal over temperature warning threshold

140

160

°C

TSD (1)

Thermal shut-down junction temperature

165

185

°C

TSDC

Central thermal shut-down junction temperature

175

195

°C

TSDhys

Thermal shut-down temperature hysteresis

°C

TF_TJ

Thermal warning/shutdown filter time

Covered by scan

µs

TF_TSDC

Central thermal shutdown filter time

Covered by scan

25.6

38.4

µs

RTh j-amb

Thermal resistance junction-to-ambient

4 layers board

°C/W

1. Non-overlapping.

SPSB100

Maximum ratings

DS14640 - Rev 2

page 9/213

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