DLPR410 datasheet(12/53 Pages) TI2

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Micromirror Landed Duty Cycle

DLP650LNIR

DLPS136 – NOVEMBER 2018

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Product Folder Links: DLP650LNIR

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(1)

The DMD is designed to conduct absorbed and dissipated heat to the back of the package. The cooling system must be capable of

maintaining the package within the temperature range specified in the Recommended Operating Conditions.

The total heat load on the DMD is largely driven by the incident light absorbed by the micromirrror array, although other contributions

include light energy outside of the active mirror array and electrical power dissipation of the silicon.

Design the optical system to minimized light outside of the active micromirror array because light outside of this area gets highly

absorbed by the optical border and increases DMD heat load.

Design the optical system to minimize the light energy falling outside the window clear aperture. Aditional thermal load in this area

contributes to window heating and significantly degrades the reliability of the device.

Figure 2. Maximum Recommended Micromirror Temperature - Derating Curve (see Landed Duty Cycle

and Operational DMD Temperature)

6.5 Thermal Information

THERMAL METRIC

DLP650LNIR

UNIT

FYL Package

149 PINS

RSILICON-TO-CERAMIC: Thermal resistance, silicon to ceramic, as measured at test point 1 (TP1)

(1)

0.5

°C/W

RMIRROR-TO-SILICON: Thermal resistance, mirror to silicon, per individual mirror

(1)

3.39 × 105

°C/W

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