DLPR410 datasheet(32/53 Pages) TI2

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TP1

TP5

TP3 (TP2)

TP3

2X 16.7

TP4

Window Edge

(4 surfaces)

4.5

16.1

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TP2

Array

TP5

TP4

2X 12.0

DLP650LNIR

DLPS136 – NOVEMBER 2018

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Optical Interface and System Image Quality Considerations (continued)

7.6.4 Illumination Overfill

The active area of the device is surrounded by an aperture on the inside DMD window surface that masks

structures of the DMD device assembly from normal view. The aperture is sized to anticipate several optical

operating conditions. Overfill light illuminating the window aperture can create artifacts from the edge of the

window aperture opening and other surface anomalies that may be included in the projected image. To reduce

DMD heating when applying high incident flux levels to the DMD in high power applications, design the

illumination optics to limit light flux incident anywhere outside the active array to nearly zero percent. For lower

incident power levels, depending on the optical architecture of a particular system, the acceptability levels of

overfill light must be determined by the user as it relates to a specific application. In most cases it is almost

always held to zero.

7.7 Micromirror Temperature Calculations

Figure 20. DMD Thermal Test Points

DLPR410 bảng dữ liệu(PDF) 32 Page - Texas Instruments