TSSOP (Thin Shrink Small Outline Package) and MSOP (Mini Small

Outline Package) are leadframe based, plastic encapsulated packages

that are well suited for applications requiring less than 1 mm

mounted height. These industry standard packages run in very high

volume and provide a value added, low-cost solution for a wide range

of applications.

TSSOP/MSOP

DATA SHEET | LEADFRAME PRODUCTS

Thermal Performance

Forced Convection, Single-Layer PCB

Package

Body Size

(mm)

θJA at (°C/W) by Velocity (LFPM)

0

200

500

16 Ld

4.4 x 5.0

137.1

118.2

106.8

20 Ld

4.4 x 6.5

114.5

98.0

88.0

Forced Convection, Multi-Layer PCB

Package

Body Size

(mm)

θJA at (°C/W) by Velocity (LFPM)

0

200

500

16 Ld

4.4 x 5.0

89.0

81.8

78.1

20 Ld

4.4 x 6.5

73.2

66.6

63.5

Electrical Performance

Simulated Results @ 100 MHz

Package

Body Size

(mm)

Lead

Inductance

(nH)

Capacitance

(pF)

Resistance

(mΩ)

8 Ld

4.4 x 3.0

Longest

Shortest

1.470

0.725

0.224

0.177

13.7

7.5

28 Ld

4.4 x 9.7

Longest

Shortest

2.100

0.713

0.368

0.180

16.1

6.8

Reliability Qualification

Amkor package qualification uses three independent production lots and a

minimum of 77 units per test group. All testing includes JSTD-020 moisture

preconditioning.

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Moisture sensitivity characterization

▷ 3 x 3 mm/4.4 mm, 8/10L: JEDEC level 1, 85°C/85% RH, 168 hours

▷ Other than 8/10L: JEDEC level 3, 30°C/60% RH, 192 hours

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uHAST: 130°C/85% RH, no bias, 96 hours

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Temp cycle: -65°C/+150°C, 500 cycles

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High temp storage: 150°C, 1000 hours

JEDEC standard test boards

FEATURES

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Cu wire interconnect for lowest cost

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Standard JEDEC package outlines

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Multi-die production capability

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Turnkey test services, including strip

test options

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Available in ExposedPad configuration

(Ref: DS571)

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Green materials are standard –

Pb-free and RoHS compliant

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Stealth dicing (narrow saw streets)

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Larger/Higher density leadframe strips

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Leadframe roughening for improved

MSL capability

PROCESS HIGHLIGHTS

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Au plated PCC wire is standard,

Au and Ag wire available

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Wafer backgrinding services available

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Multiple die and die stacking capability

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NiPdAu (PPF) lead finish is standard,

matte Sn is optional

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Laser mark on package body