TSSOP bảng dữ liệu(PDF) - Amkor Technology

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TSSOP bảng dữ liệu (PDF) - Amkor Technology

TSSOP Datasheet PDF - Amkor Technology


tên linh kiện	TSSOP

tải về	TSSOP tải về

kích thước tập tin	780.44 Kbytes

Page	3 Pages

nhà sản xuất	AMKOR [Amkor Technology]

Trang chủ	http://www.amkor.com

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Giải thích chi tiết về linh kiện

ExposedPad (ePad) TSSOP, MSOP, SOIC and SSOP are leadframe based

TSSOP Datasheet (PDF)

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tải về bảng dữ liệu

TSSOP Datasheet PDF - Amkor Technology


tên linh kiện	TSSOP

tải về	TSSOP Click to download

kích thước tập tin	780.44 Kbytes

Page	3 Pages

nhà sản xuất	AMKOR [Amkor Technology]

Trang chủ	http://www.amkor.com

Logo

Giải thích chi tiết về linh kiện	ExposedPad (ePad) TSSOP, MSOP, SOIC and SSOP are leadframe based

TSSOP bảng dữ liệu (HTML) - Amkor Technology

TSSOP Datasheet HTML 1Page - Amkor Technology

TSSOP Datasheet HTML 2Page - Amkor Technology

TSSOP Datasheet HTML 3Page - Amkor Technology

TSSOP Thông tin chi tiết sản phẩm

FEATURES
Cu wire interconnect for low cost
Standard JEDEC package outlines
Multi-die production capability
Turnkey test services, including strip test options
ExposedPad configuration for increased thermal efficiency
Up to 60% improvement in Theta JA (compared to standard TSSOP or SOIC)
Green materials are standard – Pb-free and RoHS compliant
Stealth dicing (narrow saw streets)
Larger/Higher density leadframe strips
Leadframe roughening for improved MSL capability

Số phần tương tự - TSSOP

nhà sản xuất	tên linh kiện	bảng dữ liệu	Giải thích chi tiết về linh kiện
Amkor Technology	TSSOP	411Kb / 2P	Silver Wirebonding 02/22
Amkor Technology	TSSOP	502Kb / 2P	TSSOP (Thin Shrink Small Outline Package) and MSOP (Mini Small Outline Package) are leadframe based, plastic encapsulated packages 12/21
TT Electronics.	TSSOP	562Kb / 4P	Surface Mount TSSOP Resistor Networks 08.21
Diodes Incorporated	TSSOP-14	188Kb / 14P	SUGGESTED PAD LAYOUT Rev 43
Diodes Incorporated	TSSOP-14	404Kb / 27P	SUGGESTED PAD LAYOUT Rev 52

Mô tả tương tự - TSSOP

nhà sản xuất	tên linh kiện	bảng dữ liệu	Giải thích chi tiết về linh kiện
AVAGO TECHNOLOGIES LIMI...	ASMT-RX45-XXXXX	264Kb / 8P	0.45mm Leadframe-Based Surface Mount ChipLED
	ASMT-RR45-AQ902	376Kb / 8P	0.45mm Leadframe-Based Surface Mount ChipLED Super wide 145 deg viewing angle
	HSMR-CL25	184Kb / 6P	0.25mm Blue Leadframe-Based Surface Mount ChipLED
	HSMW-CL25	178Kb / 6P	0.25mm White Leadframe-Based Surface Mount ChipLED
STMicroelectronics	TN1208	748Kb / 13P	Tape and reel shipping media for STM8 and STM32 microcontrollers in TSSOP and SSOP packages 17-Mar-2015
Integrated Device Techn...	932SQ420D	435Kb / 28P	64-pin TSSOP and MLF packages
Integrated Device Techn...	932SQ426	379Kb / 25P	64-pin TSSOP and VFQFPN packages
TT Electronics.	OPIA401	2Mb / 31P	SMD, SOP and SSOP Packages
List of Unclassifed Man...	AX-1838HS	368Kb / 6P	The separate PIN diode and preamplifier IC are assembled on a single leadframe.
Broadcom Corporation.	ASMT-RX45-XXXXX	505Kb / 9P	0.45-mm Leadframe-Based Surface Mount ChipLED

Giới thiệu về Amkor Technology

Amkor Technology is a US-based company that provides outsourced semiconductor packaging and test services. The company was founded in 1968 and is headquartered in Tempe, Arizona, USA.

Amkor's packaging and test services include advanced flip chip and wafer level packaging technologies, as well as through-silicon via (TSV) solutions. These services are used by semiconductor manufacturers to package and test their integrated circuits (ICs) for use in a wide range of applications, including mobile devices, automotive, networking, and computing.

Amkor operates factories and facilities in Asia, Europe, and the Americas, and has a global network of design and development centers. The company has a strong focus on innovation and research and development, and its packaging and test technologies are designed to improve the performance, reliability, and cost-effectiveness of its customers' products.

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