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TSSOP bảng dữ liệu (PDF) - Amkor Technology
TSSOP Datasheet PDF - Amkor Technology
tên linh kiện TSSOP
tải về  TSSOP tải về
kích thước tập tin   502.24 Kbytes
Page   2 Pages
nhà sản xuất  AMKOR [Amkor Technology]
Trang chủ  http://www.amkor.com
Logo AMKOR - Amkor Technology
Giải thích chi tiết về linh kiện TSSOP (Thin Shrink Small Outline Package) and MSOP (Mini Small Outline Package) are leadframe based, plastic encapsulated packages

TSSOP Datasheet (PDF)

Go To PDF Page tải về bảng dữ liệu
TSSOP Datasheet PDF - Amkor Technology

tên linh kiện TSSOP
tải về  TSSOP Click to download

kích thước tập tin   502.24 Kbytes
Page   2 Pages
nhà sản xuất  AMKOR [Amkor Technology]
Trang chủ  http://www.amkor.com
Logo AMKOR - Amkor Technology
Giải thích chi tiết về linh kiện TSSOP (Thin Shrink Small Outline Package) and MSOP (Mini Small Outline Package) are leadframe based, plastic encapsulated packages

TSSOP bảng dữ liệu (HTML) - Amkor Technology


TSSOP Thông tin chi tiết sản phẩm

FEATURES
Cu wire interconnect for lowest cost
Standard JEDEC package outlines
Multi-die production capability
Turnkey test services, including strip test options
Available in ExposedPad configuration (Ref: DS571)
Green materials are standard – Pb-free and RoHS compliant
Stealth dicing (narrow saw streets)
Larger/Higher density leadframe strips
Leadframe roughening for improved MSL capability




Số phần tương tự - TSSOP

nhà sản xuấttên linh kiệnbảng dữ liệuGiải thích chi tiết về linh kiện
logo
Amkor Technology		 TSSOP AMKOR-TSSOP Datasheet
780Kb / 3P		 ExposedPad (ePad) TSSOP, MSOP, SOIC and SSOP are leadframe based
12/21
TSSOP AMKOR-TSSOP Datasheet
411Kb / 2P		 Silver Wirebonding
02/22
logo
TT Electronics.		 TSSOP TTELEC-TSSOP Datasheet
562Kb / 4P		 Surface Mount TSSOP Resistor Networks
08.21
logo
Diodes Incorporated		 TSSOP-14 DIODES-TSSOP-14 Datasheet
188Kb / 14P		 SUGGESTED PAD LAYOUT
Rev 43
TSSOP-14 DIODES-TSSOP-14 Datasheet
404Kb / 27P		 SUGGESTED PAD LAYOUT
Rev 52
More results


Mô tả tương tự - TSSOP

nhà sản xuấttên linh kiệnbảng dữ liệuGiải thích chi tiết về linh kiện
logo
STMicroelectronics		 SSOP24 STMICROELECTRONICS-SSOP24 Datasheet
59Kb / 4P		 24-LEAD SHRINK SMALL OUTLINE PACKAGE
Nov-2002
logo
National Semiconductor ...		 MTD48 NSC-MTD48 Datasheet
62Kb / 1P		 48 Lead Molded Thin Shrink Small Outline Package, JEDEC
logo
Intersil Corporation		 M24.173B INTERSIL-M24.173B Datasheet
42Kb / 1P		 Thin Shrink Small Outline Wxposed Pad Plastic Packages ( EPTSSOP)
logo
fujitsu semiconductor		 FPT-20P-M04 FUJITSU-FPT-20P-M04 Datasheet
37Kb / 1P		 THIN SHRINK SMALL OUTLINE PACKAGE
logo
Amkor Technology		 CSSOP AMKOR-CSSOP Datasheet
304Kb / 1P		 Ceramic Shrink Small Outline Package
logo
ACCUTEK MICROCIRCUIT CO...		 AK08D300 ACCUTEK-AK08D300_12 Datasheet
68Kb / 2P		 Micro Small Outline Package MSOP DIP Adapters
logo
Advanced Power Electron...		 AP2306AGEN-HF A-POWER-AP2306AGEN-HF_14 Datasheet
101Kb / 4P		 Small Outline Package
AP2318AGEN-HF A-POWER-AP2318AGEN-HF_14 Datasheet
64Kb / 4P		 Small Outline Package
logo
Amkor Technology		 SSOP AMKOR-SSOP Datasheet
433Kb / 2P		 Shrink Small Outline, Quarter-Size Small-Outline Packages
logo
Guangdong Youtai Semico...		 LM75B UMW-LM75B Datasheet
312Kb / 23P		 plastic thin shrink small outline package; 8 leads;
More results




Giới thiệu về Amkor Technology

Amkor Technology is a US-based company that provides outsourced semiconductor packaging and test services. The company was founded in 1968 and is headquartered in Tempe, Arizona, USA.

Amkor's packaging and test services include advanced flip chip and wafer level packaging technologies, as well as through-silicon via (TSV) solutions. These services are used by semiconductor manufacturers to package and test their integrated circuits (ICs) for use in a wide range of applications, including mobile devices, automotive, networking, and computing.

Amkor operates factories and facilities in Asia, Europe, and the Americas, and has a global network of design and development centers. The company has a strong focus on innovation and research and development, and its packaging and test technologies are designed to improve the performance, reliability, and cost-effectiveness of its customers' products.

*Thông tin này chỉ dành cho mục đích thông tin chung, chúng tôi sẽ không chịu trách nhiệm cho bất kỳ tổn thất hoặc thiệt hại nào do thông tin trên gây ra.




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