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TSSOP bảng dữ liệu(PDF) 2 Page - Amkor Technology

tên linh kiện TSSOP
Giải thích chi tiết về linh kiện  TSSOP (Thin Shrink Small Outline Package) and MSOP (Mini Small Outline Package) are leadframe based, plastic encapsulated packages
PDF  2 Pages
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nhà sản xuất  AMKOR [Amkor Technology]
Trang chủ  http://www.amkor.com
Logo AMKOR - Amkor Technology

TSSOP bảng dữ liệu(HTML) 2 Page - Amkor Technology

  TSSOP Datasheet HTML 1Page - Amkor Technology TSSOP Datasheet HTML 2Page - Amkor Technology  
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With respect to the information in this document, Amkor makes no guarantee or warranty of its accuracy or that the use of such
information will not infringe upon the intellectual rights of third parties. Amkor shall not be responsible for any loss or damage of
whatever nature resulting from the use of, or reliance upon it and no patent or other license is implied hereby. This document does not
in any way extend or modify Amkor’s warranty on any product beyond that set forth in its standard terms and conditions of sale. Amkor
reserves the right to make changes in its product and specifications at any time and without notice. The Amkor name and logo are
registered trademarks of Amkor Technology, Inc. All other trademarks mentioned are property of their respective companies.
© 2021 Amkor Technology, Incorporated. All Rights Reserved. DS350T-EN Rev Date: 12/21
Visit amkor.com or email sales@amkor.com for more information.
Services And Support
Amkor has a broad base of resources available to help
customers bring quality products to market quickly and
at the lowest possible cost.
f
Full package characterization
f
Thermal, mechanical stress and electrical
performance modeling
f
Turnkey assembly, test and drop ship
f
World-class reliability testing and failure analysis
Test Services
f
Program generation/conversion
f
Wafer probe
f
Burn-in capabilities
f
-55°C to +165°C test available
f
Strip test available
TSSOP/MSOP
Configuration Options
TSSOP/MSOP Nominal Package Dimensions (mm)
Package
Type
Lead
Count
Body
Width
Body
Length
Body
Thickness
Standoff
Overall
Height
Lead
Pitch
Tip-to-Tip
JEDEC
TSSOP
8
4.4
3.0
0.90
0.10
1.00
0.65
6.4
MO-153
14
4.4
5.0
0.90
0.10
1.00
0.65
6.4
MO-153
16
4.4
5.0
0.90
0.10
1.00
0.65
6.4
MO-153
20
4.4
6.5
0.90
0.10
1.00
0.65
6.4
MO-153
28
4.4
9.7
0.90
0.10
1.00
0.65
6.4
MO-153
38
4.4
9.7
0.90
0.10
1.00
0.50
6.4
MO-153
MSOP
8
3.0
3.0
0.85
0.10
0.95
0.65
5.0
MO-187
10
3.0
3.0
0.85
0.10
0.95
0.50
5.0
MO-187
Shipping
f
Clear anti-static tube, 20 inch
f
Tape and reel
f
Dry pack
f
Drop ship
Cross Section TSSOP/MSOP
Wirebond
Die attach adhesive
Mold compound
A
B
Die attach pad
Cu leadframe
C
D
E
C
A
B
E
D



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