AD9914SLASHPCBZ datasheet(9/48 Pages) AD

9 / 48 page

Data Sheet

AD9914

ABSOLUTE MAXIMUM RATINGS

analog.com

Rev. G | 9 of 48

Table 3.

Parameter

Rating

AVDD (1.8 V), DVDD (1.8 V) Supplies

2 V

AVDD (3.3 V), DVDD_I/O (3.3 V) Supplies

4 V

Digital Input Voltage

−0.7 V to +4 V

Digital Output Current

5 mA

Storage Temperature Range

−65°C to +150°C

Operating Temperature Range

−40°C to +85°C

Maximum Junction Temperature

150°C

Lead Temperature (10 sec Soldering)

300°C

Stresses at or above those listed under Absolute Maximum Ratings

may cause permanent damage to the product. This is a stress

rating only; functional operation of the product at these or any other

conditions above those indicated in the operational section of this

specification is not implied. Operation beyond the maximum operat-

ing conditions for extended periods may affect product reliability.

THERMAL PERFORMANCE

Table 4.

Symbol

Description

Value1

Unit

θJA

Junction-to-ambient thermal resistance (still

air) per JEDEC JESD51-2

24.1

°C/W

θJMA

Junction-to-ambient thermal resistance (1.0

m/sec airflow) per JEDEC JESD51-6

21.3

°C/W

θJMA

Junction-to-ambient thermal resistance (2.0

m/sec air flow) per JEDEC JESD51-6

20.0

°C/W

θJB

Junction-to-board thermal resistance (still

air) per JEDEC JESD51-8

13.3

°C/W

ΨJB

Junction-to-board characterization

parameter (still air) per JEDEC JESD51-6

12.8

°C/W

θJC

Junction-to-case thermal resistance

2.21

°C/W

ΨJT

Junction-to-top-of-package characterization

parameter (still air) per JEDEC JESD51-2

0.23

°C/W

1 Results are from simulations. Printed circuit board (PCB) is JEDEC multilayer.

Thermal performance for actual applications requires careful inspection of the

conditions in the application to determine if they are similar to those assumed

in these calculations.

ESD CAUTION

ESD (electrostatic discharge) sensitive device. Charged devi-

ces and circuit boards can discharge without detection. Although

this product features patented or proprietary protection circuitry,

damage may occur on devices subjected to high energy ESD.

Therefore, proper ESD precautions should be taken to avoid

performance degradation or loss of functionality.

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