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MPC8555CPXAPF bảng dữ liệu(PDF) 55 Page - Freescale Semiconductor, Inc

tên linh kiện MPC8555CPXAPF
Giải thích chi tiết về linh kiện  PowerQUICC??III Integrated Communications Processor Hardware Specifications
PDF  88 Pages
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nhà sản xuất  FREESCALE [Freescale Semiconductor, Inc]
Trang chủ  http://www.freescale.com
Logo FREESCALE - Freescale Semiconductor, Inc

MPC8555CPXAPF bảng dữ liệu(HTML) 55 Page - Freescale Semiconductor, Inc

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MPC8555E PowerQUICC™ III Integrated Communications Processor Hardware Specifications, Rev. 4
Freescale Semiconductor
55
Package and Pin Listings
Figure 39 shows the PCI input AC timing conditions.
Figure 39. PCI Input AC Timing Measurement Conditions
Figure 40 shows the PCI output AC timing conditions.
Figure 40. PCI Output AC Timing Measurement Condition
14 Package and Pin Listings
This section details package parameters, pin assignments, and dimensions.
14.1
Package Parameters for the MPC8555E FC-PBGA
The package parameters are as provided in the following list. The package type is 29 mm
× 29 mm, 783
flip chip plastic ball grid array (FC-PBGA).
Die size
8.7 mm
× 9.3 mm × 0.75 mm
Package outline
29 mm
× 29 mm
Interconnects
783
Pitch
1 mm
Minimum module height 3.07 mm
Maximum module height 3.75 mm
Solder Balls
62 Sn/36 Pb/2 Ag
Ball diameter (typical)
0.5 mm
tPCIVKH
CLK
Input
tPCIXKH
CLK
Output Delay
tPCKHOV
High-Impedance
tPCKHOZ
Output



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