MPC8540CVT667JC datasheet(82/104 Pages) FREESCALE

tên linh kiện	MPC8540CVT667JC

Giải thích chi tiết về linh kiện	Integrated Processor Hardware Specifications

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MPC8540 Integrated Processor Hardware Specifications, Rev. 4

Freescale Semiconductor

Thermal

Figure 45. MPC8540 Thermal Model

16.2.2 Internal Package Conduction Resistance

For the packaging technology, shown in Table 59, the intrinsic internal conduction thermal resistance paths

are as follows:

•

The die junction-to-case thermal resistance

•

The die junction-to-board thermal resistance

Figure 46 depicts the primary heat transfer path for a package with an attached heat sink mounted to a

printed-circuit board.

Die

Lid

Substrate and solder balls

Heat Source

Substrate

Side View of Model (Not to Scale)

Top View of Model (Not to Scale)

Conductivity

Value

Unit

Lid

(12

× 14 × 1 mm)

360

W/(m

× K)

360

Lid Adhesive—Collapsed resistance

(10

× 12 × 0.050 mm)

Die

(10

× 12 × 0.76 mm)

Bump/Underfill—Collapsed resistance

(10

× 12 × 0.070 mm)

0.6

1.9

Substrate and Solder Balls

(29

× 29 × 1.47 mm)

10.2

1.6

Adhesive

Bump/underfill

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