PCF8812USLASH2 datasheet(34/36 Pages) PHILIPS

34 / 36 page

2000 Nov 22

Philips Semiconductors

Product speciﬁcation

× 102 pixels matrix LCD driver

PCF8812

22 TRAY INFORMATION

handbook, full pagewidth

,,,,,,,

MGT651

1,1

x,1

2,1

1,2

1,3

1,y

x,y

2,2

3,1

SECTION A-A

Fig.22 Tray details.

Table 10 Tray dimensions

handbook, halfpage

MGT652

Fig.23 Tray alignment.

The orientation of the IC in a pocket is indicated by the position of

the IC type name on the die surface with respect to the chamfer on

the upper left corner of the tray. Refer to the bonding pad location

diagram for the orientating and position of the type name on the die

surface.

DIMENSION

DESCRIPTION

VALUE

pocket pitch; x direction

13.77 mm

pocket pitch; y direction

4.37 mm

pocket width; x direction

11.04 mm

pocket width; y direction

2.24 mm

tray width; x direction

50.8 mm

tray width; y direction

50.8 mm

distance from cut corner

to pocket (1 and 1) centre

11.68 mm

distance from cut corner

to pocket (1 and 1) centre

5.74 mm

tray thickness

3.96 mm

tray cross section

1.78 mm

tray cross section

2.49 mm

pocket depth

0.89 mm

no. pockets in x direction

no. pockets in y direction

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