AD9271 datasheet(11/58 Pages) AD

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Preliminary Technical Data

AD9271

Rev. PrA | Page 11 of 58

ABSOLUTE MAXIMUM RATINGS

Table 4.

Parameter

With

Respect To

Rating

ELECTRICAL

AVDD

GND

−0.3 V to +2.0 V

DRVDD

GND

−0.3 V to +2.0 V

CWVDD

GND

−0.3 V to +3.9 V

GND

−0.3 V to +0.3 V

AVDD

DRVDD

−2.0 V to +2.0 V

Digital Outputs

(DOUT+, DOUT−, DCO+,

DCO−, FCO+, FCO−)

GND

−0.3 V to +2.0 V

CLK+, CLK−

GND

−0.3 V to +3.9 V

LI-x

LG-x

−0.3 V to +2.0 V

LO-x

LG-x

−0.3 V to +2.0 V

LOSW-x

LG-x

−0.3 V to +2.0 V

CWDx−, CWDx+

GND

−0.3 V to +2.0 V

SDIO, GAIN+,GAIN−

GND

−0.3 V to +2.0 V

PDWN, STBY, SCLK, CSB

GND

−0.3 V to +3.9 V

REFT, REFB, RBIAS

GND

−0.3 V to +2.0 V

VREF, SENSE

GND

−0.3 V to +2.0 V

ENVIRONMENTAL

Operating Temperature

Range (Ambient)

−40°C to +85°C

Maximum Junction

Temperature

150°C

Lead Temperature

(Soldering, 10 sec)

300°C

Storage Temperature

Range (Ambient)

−65°C to +150°C

Stresses above those listed under Absolute Maximum Ratings

may cause permanent damage to the device. This is a stress

rating only; functional operation of the device at these or any

other conditions above those indicated in the operational

section of this specification is not implied. Exposure to absolute

maximum rating conditions for extended periods may affect

device reliability.

THERMAL IMPEDANCE

Table 5.

Air Flow Velocity (m/s)

θJA1

θJB

θJC

0.0

20.3°C/W

1.0

14.4°C/W

7.6°C/W

4.7°C/W

2.5

12.9°C/W

1 θJA for a 4-layer PCB with solid ground plane (simulated). Exposed pad

soldered to PCB.

ESD CAUTION

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