S32K310 datasheet(92/146 Pages) NXP

tên linh kiện	S32K310

Giải thích chi tiết về linh kiện	Supports S32K344, S32K324, S32K314, S32K312, S32K341 and S32K342. Data is preliminary for S32K311, S32K310, S32K328, S32K338, S32K348, S32K358 and S32K388

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10.4 Temperature Sensor

The table below gives the specification for the on die temperature sensor.

Table 35. Temperature Sensor

Symbol

Description

Min

Typ

Max

Unit

Condition

Spec

Number

TS_TJ

Junction

temperature

monitoring range

-40

—

150

°C

—

TS_IV25

ON state current

consumption on V25

—

400

—

µA

ETS_EN=1

—

TS_ACC1

Temperature output

error at circuit output

(Voltage) 1, 2, 3

-5

°C

100 °C < Tj <= 150 °C

—

TS_ACC2

Temperature output

error at circuit output

(Voltage) 1, 2, 3

-10

+10

°C

-40 °C <= Tj <=100 °C —

TS_TSTART

Circuit start up time

—

µs

—

TS_TADCSA

Required ADC

sampling time 1

1.2

—

µs

—

1. Required ADC sampling time specified by parameter TS_TADCSA needs to be used at the ADC conversion to guarantee

the specified accuracy. A smaller sampling time leads to a less accurate result.

2. Note: The temperature sensor measures the junction temperature Tj at the location where it is placed on die. The local Tj

is modulated by current and previous active state of the circuit elements on die.

3. The error caused by ADC conversion and provided temperature calculation formula is not included.

11 Clocking modules

11.1 FIRC

Table 36. FIRC

Symbol

Description

Min

Typ

Max

Unit

Condition

Spec

Number

fFIRC

FIRC nominal

Frequency

—

MHz

—

FACC

FIRC Frequency

deviation across

process, voltage,

and temperature

after trimming

-5

—

TSTART

Startup Time 1

—

1. Startup time is for reference only.

NXP Semiconductors

Clocking modules

S32K3xx Data Sheet, Rev. 7, 04/2023

Data Sheet: Technical Data

Preliminary Information

92 / 146

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