MPC750ECSLASHD datasheet(6/44 Pages) NXP

6 / 44 page

MPC750A RISC Microprocessor Hardware Speciﬁcations

General Parameters

— Automatic dynamic power reduction when internal functional units are idle

•

Integrated Thermal Management Assist Unit

— On-chip thermal sensor and control logic

— Thermal Management Interrupt for software regulation of junction temperature.

•

Testability

— LSSD scan design

— JTAG interface

•

Reliability and serviceability—Parity checking on 60x and L2 cache buses

1.3 General Parameters

The following list provides a summary of the general parameters of the MPC750:

Technology:

0.29 µm CMOS, ﬁve-layer metal

Die size:

7.56 mm x 8.79 mm (67 mm2)

Transistor count

6.35 million

Logic design

Fully-static

Packages

MPC740: Surface mount 255 ceramic ball grid array (CBGA) without L2

interface

MPC750: Surface mount 360 ceramic ball grid array (CBGA) with L2

interface

Core power supply:

2.6V ± 100 mV

I/O power supply

3.3V ± 5% V dc

1.4 Electrical and Thermal Characteristics

This section provides the AC and DC electrical speciﬁcations and thermal characteristics for the MPC750.

1.4.1 DC Electrical Characteristics

The tables in this section describe the MPC750 DC electrical characteristics. Table 2 provides the absolute

maximum ratings.

Table 2. Absolute Maximum Ratings

Characteristic

Symbol

MPC750A Value

Unit

Notes

Core supply voltage

Vdd

–0.3 to 2.75

PLL supply voltage

AVdd

–0.3 to 2.75

L2 DLL supply voltage

L2AVdd

–0.3 to 2.75

60x bus supply voltage

OVdd

–0.3 to 3.6

3,5

Freescale Semiconductor, Inc.

For More Information On This Product,

Go to: www.freescale.com

IVE

D B

Y F

INC

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