MPC750ECSLASHD datasheet(30/44 Pages) NXP

tên linh kiện	MPC750EC/D

Giải thích chi tiết về linh kiện	MPC750A RISC Microprocessor Hardware Specifications

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MPC750A RISC Microprocessor Hardware Speciﬁcations

Package Description

Figure 16. Mechanical Dimensions and Bottom Surface Nomenclature of the MPC740

1.7.3 Parameters for the MPC750

The package parameters are as provided in the following list. The package type is 25 x 25 mm, 360-lead

ceramic ball grid array (CBGA).

Package outline

25 x 25 mm

Interconnects

360 (19 x 19 ball array - 1)

Pitch

1.27 mm (50 mil)

Minimum module height

2.65 mm

Maximum module height

3.20 mm

Ball diameter

0.89 mm (35 mil)

Notes:

Dimensioning and tolerancing per

ASME Y14.5M, 1994.

Dimensions in millimeters.

Top side A1 corner index is a metalized

feature with various shapes. bottom side

A1 corner is designated with a ball

0.2

255X

A1 CORNER

0.2

123456789 10 11 12 13 14 15 16

e/2

0.3

0.15

e/2

0.15 C

Millimeters

DIM

Min

Max

2.45

3.00

0.79

0.99

0.9

1.10

0.82

0.93

21.00 BSC

8.3

8.5

1.27 BSC

21.00 BSC

9.0

9.2

2.00

Freescale Semiconductor, Inc.

For More Information On This Product,

Go to: www.freescale.com

IVE

D B

Y F

INC

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