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STM32L100RC bảng dữ liệu(PDF) 91 Page - STMicroelectronics |
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STM32L100RC bảng dữ liệu(HTML) 91 Page - STMicroelectronics |
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91 / 106 page ![]() DocID024995 Rev 5 91/106 STM32L100RC 97 Figure 25. Maximum dynamic current consumption on VREF+ supply pin during ADC conversion General PCB design guidelines Power supply decoupling should be performed as shown in Figure 7. The applicable procedure depends on whether VREF+ is connected to VDDA or not. The 100 nF capacitors should be ceramic (good quality). They should be placed as close as possible to the chip. ADC clock Sampling (n cycles) Conversion (12 cycles) Iref+ 300µA 700µA MS36686V1 Table 56. Maximum source impedance RAIN max(1) Ts (µs) RAIN max (kΩ) Ts (cycles) fADC=16 MHz(2) Multiplexed channels Direct channels 2.4 V < VDDA < 3.6 V 1.8 V < VDDA < 2.4 V 2.4 V < VDDA < 3.6 V 1.8 V < VDDA < 2.4 V 0.25 Not allowed Not allowed 0.7 Not allowed 4 0.5625 0.8 Not allowed 2.0 1.0 9 1 2.0 0.8 4.0 3.0 16 1.5 3.0 1.8 6.0 4.5 24 3 6.8 4.0 15.0 10.0 48 6 15.0 10.0 30.0 20.0 96 12 32.0 25.0 50.0 40.0 192 24 50.0 50.0 50.0 50.0 384 1. Guaranteed by design. 2. Number of samples calculated for fADC = 16 MHz. For fADC = 8 and 4 MHz the number of sampling cycles can be reduced with respect to the minimum sampling time Ts (µs), |
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