STM32WB35CC datasheet(184/193 Pages) STMICROELECTRONICS

184 / 193 page

Package information

STM32WB55xx STM32WB35xx

184/193

DS11929 Rev 11

7.5.1

Reference document

JESD51-2 Integrated Circuits Thermal Test Method Environment Conditions - Natural

Convection (Still Air). Available from www.jedec.org

7.5.2

Selecting the product temperature range

When ordering the microcontroller, the temperature range is specified in the ordering

information scheme shown in Section 8.

Each temperature range suffix corresponds to a specific guaranteed ambient temperature at

maximum dissipation and, to a specific maximum junction temperature.

As applications do not commonly use the device at maximum dissipation, it is useful to

calculate the exact power consumption and junction temperature to determine which

temperature range is best suited to the application.

The following examples show how to calculate the temperature range needed for a given

application.

Example 1: High-performance application

Assuming the following application conditions:

Maximum ambient temperature TA max = 82 °C (measured according to JESD51-2),

IDD max = 50 mA, VDD = 3.5 V, maximum 20 I/Os used at the same time in output at

low level with IOL = 8 mA, VOL = 0.4 V and maximum 8 I/Os used at the same time in

output at low level with IOL = 20 mA, VOL= 1.3 V

PINT max = 50 mA × 3.5 V = 175 mW

PIO max = 20 × 8 mA × 0.4 V + 8 × 20 mA × 1.3 V = 272 mW

This gives: PINT max = 175 mW and PIO max = 272 mW

PD max = 175 + 272 = 447 mW

Using the values obtained in Table 106 TJ max is calculated as follows:

–

For VFQFPN68, 47 °C / W

TJ max = 82 °C + (47 °C / W × 447 mW) = 82 °C + 21 °C = 103 °C

This is within the range of the suffix 6 version parts (–40 < TJ < 105 °C), see Section 8.

In this case, parts must be ordered at least with the temperature range suffix 6.

ΘJC

Thermal resistance junction-case

UFQFPN48 - 7 mm x 7 mm

1.3

°C/W

Thermal resistance junction-case

VFQFPN68 - 8 mm x 8 mm

13.7

Thermal resistance junction-case

WLCSP100 - 0.4 mm pitch

N/A

Thermal resistance junction-case

UFBGA129 - 0.5 mm pitch

34.9

Table 106. Package thermal characteristics (continued)

Symbol

Parameter

Value

Unit

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