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STM32WB35CC bảng dữ liệu(PDF) 83 Page - STMicroelectronics

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Giải thích chi tiết về linh kiện  Multiprotocol wireless 32-bit MCU Arm®-based Cortex®-M4 with FPU, Bluetooth® 5.2 and 802.15.4 radio solution
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STM32WB35CC bảng dữ liệu(HTML) 83 Page - STMicroelectronics

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DS11929 Rev 11
83/193
STM32WB55xx STM32WB35xx
Electrical characteristics
169
Figure 17. Power supply scheme (UFBGA129 and WLCSP100 packages)
1. The value of L1 depends upon the frequency, as indicated in Table 6.
2. For UFBGA129 package VDD_DCAPx and VSS_DCAPx balls are connected to VDD and VSS internally, to
simplify the 2-layer board layout and especially the ground plane below the BGA.
VDD power supply can be made with a single connection to the center of the BGA on the board bottom
layer. The decoupling 100 nF capacitors are connected without cutting the board ground plane.
3. n x 100 nF only for WLCSP package.
MS53132V2
VDD
Backup circuitry
(LSE, RTC and
backup registers)
Kernel logic
(CPU, digital
and memories
IO
logic
IN
OUT
Regulator
GPIOs
1.55 to 3.6 V
n x 100 nF +
1 x 4.7 μF
(3)
n x VSS
n x VDD
VBAT
VCORE
Power switch
VDDIO1
ADCs
OPAMPs
COMPs
VREFBUF
VREF+
VREF-
VDDA
10 nF + 1 μF
VDDA
VSSA
VREF
100 nF 1 μF
SMPS
Regulator
VDDSMPS
VLXSMPS
VFBSMPS
VSSSMPS
4.7 μF
VDD
L1
(1)
4.7 μF
SMPS
VSS_DCAPx
(2)
VDD_DCAPx
(2)
1 x 100 nF
USB
transceiver
VDDUSB
VDD
100 nF
Radio
100 nF
+ 100 pF
VDDRF
VSSRF
VDD



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