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STM32WB35CC bảng dữ liệu(PDF) 170 Page - STMicroelectronics

tên linh kiện STM32WB35CC
Giải thích chi tiết về linh kiện  Multiprotocol wireless 32-bit MCU Arm®-based Cortex®-M4 with FPU, Bluetooth® 5.2 and 802.15.4 radio solution
PDF  193 Pages
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nhà sản xuất  STMICROELECTRONICS [STMicroelectronics]
Trang chủ  http://www.st.com
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STM32WB35CC bảng dữ liệu(HTML) 170 Page - STMicroelectronics

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Package information
STM32WB55xx STM32WB35xx
170/193
DS11929 Rev 11
7
Package information
In order to meet environmental requirements, ST offers these devices in different grades of
ECOPACK packages, depending on their level of environmental compliance. ECOPACK
specifications, grade definitions and product status are available at: www.st.com.
ECOPACK is an ST trademark.
7.1
UFBGA129 package information
This UFBGA is a 129-ball, 7 x 7 mm, 0.5 mm fine pitch, square ball grid array package.
Figure 38. UFBGA129 package outline
1. Drawing is not to scale.
2. - The terminal A1 corner must be identified on the top surface by using a corner chamfer,
ink or metalized markings, or other feature of package body or integral heat slug.
- A distinguishing feature is allowable on the bottom surface of the package to identify the terminal A1
corner. Exact shape of each corner is optional.
Table 100. UFBGA129 mechanical data
Symbol
millimeters
inches(1)
Min
Typ
Max
Min
Typ
Max
A(2)
-
-
0.60
-
-
0.024
A1
-
-
0.11
-
-
0.004
A2
-
0.13
-
-
0.005
-
A4
-
0.32
-
-
0.013
-
b(3)
0.24
0.29
0.34
0.009
0.011
0.013
B09R_UFBGA129_ME_V2
e
E
E1
B
F
F
D1
D
e
1
2
3
7
8
9
4
5
6
11
12
13
10
EF G H
AB C D
N
JK L M
A1 corner index area
BOTTOM VIEW
b (129 balls)
eee
f f f M
M
C
C
A
B
A
A1
ddd
C
b
A2
A4
SEATING
PLANE



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