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VSC8166 bảng dữ liệu(PDF) 5 Page - Vitesse Semiconductor Corporation |
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VSC8166 bảng dữ liệu(HTML) 5 Page - Vitesse Semiconductor Corporation |
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5 / 16 page ![]() © VITESSE SEMICONDUCTOR CORPORATION Page 5 11/9/99 741 Calle Plano, Camarillo, CA 93012 • 805/388-3700 • FAX: 805/987-5896 VITESSE SEMICONDUCTOR CORPORATION Preliminary Datasheet VSC8166 2.488 Gbit/sec 1:16 SONET/SDH Demux with Clock Recovery G52252-0, Rev. 3.0 Figure 5: High Speed Serial Data Inputs Supplies This device is specified as a LVPECL device with a single positive 3.3V supply. Should the user desire to use the device in a ECL environment with a negative 3.3V supply, then VCC will be ground and VEE will be - 3.3V. Decoupling of the power supplies is a critical element in maintaining the proper operation of the part. It is recommended that the VCC power supply be decoupled using a 0.1µF and 0.01µF capacitor placed in parallel on each VCC power supply pin as close to the package as possible. If room permits, a 0.001µF capacitor should also be placed in parallel with the 0.1 µF and 0.01µF capacitors mentioned above. Recommended capacitors are low inductance ceramic SMT X7R devices. For the 0.1 µF capacitor, a 0603 package should be used. The 0.01 µF and 0.001µF capacitors can be either 0603 or 0403 packages. For low frequency decoupling, 47 µF tantalum low inductance SMT caps should be sprinkled over the board’s main +3.3V power supply and placed close to the C-L-C pi filter. If the device is being used in an ECL environment with a -3.3V supply, then all references to decoupling VCC must be changed to VEE, and all references to decoupling 3.3V must be changed to -3.3V. VCC = 3.3V VEE = 0V CIN Chip Boundary CIN TYP = 100 pF CAC TYP = 100pF ZO VTerm CAC 50 Ω 50 Ω CIN ZO |
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