Reference

Dimensions

Millimeters

Inches

Min.

Typ.

Max.

Min.

Typ.

Max.

A (1)

1.00

0.039

A1

0.125

0.005

A2

0.615

0.024

A3

0.18

0.007

A4

0.45

0.018

b (2)

0.22

0.26

0.30

0.009

0.010

0.012

D

2.95

3.00

3.05

0.116

0.118

0.120

D1

2.40

0.094

E

2.95

3.00

3.05

0.116

0.118

0.120

E1

2.40

0.094

e

0.40

0.016

F

0.30

0.012

ddd

0.08

0.003

eee (3)

0.13

0.005

fff (4)

0.04

0.002

1. VFBGA stands for very thin profile fine pitch ball grid array. Very thin profile: 0.80 mm < A ≤ 1.00 mm / fine pitch: e < 1.00

mm. The maximum total package height is calculated by the following methodology: A2 Typ. + A1 Typ. + square-root(A1

+A3 +A4 tolerance values).

2. The typical ball diameter before mounting is 0.25 mm.

3. The tolerance of the position that controls the location of the pattern of balls with respect to datums A and B. For each ball

there is a cylindrical tolerance zone, eee, perpendicular to datum C and located on the true position with respect to datums

A and B as defined by e. The axis perpendicular to datum C of each ball must lie within this tolerance zone.

4. The tolerance of the position that controls the location of the balls within the matrix with respect to each other. For each ball,

there is a cylindrical tolerance zone, fff, perpendicular to datum C and located on the true position as defined by e. The axis

perpendicular to datum C of each ball must lie within this tolerance zone. Each tolerance zone fff in the array is contained

entirely in the respective zone eee above. The axis of each ball must lie simultaneously in both tolerance zones.

STMIPID02

VFBGA package information

DS12803 - Rev 1

page 43/50