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EMC2302 bảng dữ liệu(PDF) 63 Page - Microchip Technology

tên linh kiện EMC2302
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nhà sản xuất  MICROCHIP [Microchip Technology]
Trang chủ  http://www.microchip.com
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EMC2302 bảng dữ liệu(HTML) 63 Page - Microchip Technology

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 2021 Microchip Technology Inc.
DS20006532A-page 63
EMC2301/2/3/5
RECOMMENDED LAND PATTERN
Dimension Limits
Units
C2
Optional Center Pad Width
Contact Pad Spacing
Optional Center Pad Length
Contact Pitch
Y2
X2
2.20
2.20
MILLIMETERS
0.65 BSC
MIN
E
MAX
3.70
Contact Pad Length (X16)
Contact Pad Width (X16)
Y1
X1
1.10
0.37
Microchip Technology Drawing C04-2381A
NOM
16-Lead Very Thin Plastic Quad Flat, No Lead Package (AP) - 4x4 mm Body [VQFN]
SILK SCREEN
1
2
16
C1
Contact Pad Spacing
3.70
Space Between Pads
G1
0.30
Thermal Via Diameter
V
Thermal Via Pitch
EV
0.30
1.00
BSC: Basic Dimension. Theoretically exact value shown without tolerances.
Notes:
Dimensioning and tolerancing per ASME Y14.5M
For best soldering results, thermal vias, if used, should be filled or tented to avoid solder loss during
reflow process
1.
2.
For the most current package drawings, please see the Microchip Packaging Specification located at
http://www.microchip.com/packaging
Note:
SMSC Legacy AP [SQFN]
E
C1
C2
EV
EV
X2
Y2
X1
Y1
G1
ØV
0.79
G2
Contact Pad to Center Pad (X16)
G2
0.20



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