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CDCDB800 bảng dữ liệu(PDF) 6 Page - Texas Instruments

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Giải thích chi tiết về linh kiện  CDCDB800 DB800ZL-Compliant 8-Output Clock Buffer for PCIe Gen 1 to Gen 5
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CDCDB800 bảng dữ liệu(HTML) 6 Page - Texas Instruments

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6 Specifications
6.1 Absolute Maximum Ratings
over operating free-air temperature range (unless otherwise noted)(1)
MIN
MAX
UNIT
VDD, VDD_R
Power supply voltage
−0.3
3.6
V
VIN
IO input voltage
−0.3
3.6
V
TJ
Junction temperature
125
°C
Tstg
Storage temperature
−65
150
°C
(1)
Stresses beyond those listed under Absolute Maximum Rating may cause permanent damage to the device. These are stress
ratings only, which do not imply functional operation of the device at these or any other conditions beyond those indicated
under Recommended Operating Condition. Exposure to absolute-maximum-rated conditions for extended periods may affect device
reliability.
6.2 ESD Ratings
VALUE
UNIT
V(ESD)
Electrostatic discharge
Human body model (HBM), per ANSI/ESDA/JEDEC
JS-001, all pins(1)
±3500
V
Charged device model (CDM), per JEDEC
specification JESD22-C101, all pins(2)
±1000
(1)
JEDEC document JEP155 states that 500-V HBM allows safe manufacturing with a standard ESD control process.
(2)
JEDEC document JEP157 states that 250-V CDM allows safe manufacturing with a standard ESD control process.
6.3 Recommended Operating Conditions
over operating free-air temperature range (unless otherwise noted)
MIN
NOM
MAX
UNIT
VDD
IO, Core supply voltage
3
3.3
3.6
V
VDD_R
Input supply voltage
3
3.3
3.6
V
TA
Ambient temperature
−40
105
°C
6.4 Thermal Information
THERMAL METRIC(1)
Device Package
UNIT
RSL (QFN)
48 PINS
RθJA
Junction-to-ambient thermal resistance
32.2
°C/W
RθJC(top)
Junction-to-case (top) thermal resistance
22.3
°C/W
RθJB
Junction-to-board thermal resistance
14.3
°C/W
ΨJT
Junction-to-top characterization parameter
0.5
°C/W
ΨJB
Junction-to-board characterization parameter
14.2
°C/W
RθJC(bot)
Junction-to-case (bottom) thermal resistance
6.1
°C/W
(1)
For more information about traditional and new thermal metrics, see the Semiconductor and IC Package Thermal Metrics application
report.
CDCDB800
SNAS818 – JULY 2021
www.ti.com
6
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Copyright © 2021 Texas Instruments Incorporated
Product Folder Links: CDCDB800



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