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MCP47FVB01 bảng dữ liệu(PDF) 69 Page - Microchip Technology

tên linh kiện MCP47FVB01
Giải thích chi tiết về linh kiện  8- /10- /12-Bit Single/Dual Voltage Output Volatile Digital-to-Analog Converters with I짼C??Interface
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 2015 Microchip Technology Inc.
DS20005405A-page 69
MCP47FVBXX
8.10.2
LAYOUT CONSIDERATIONS
Several layout considerations may be applicable to
your application. These may include:
• Noise
• PCB Area Requirements
8.10.2.1
Noise
Inductively-coupled AC transients and digital switching
noise can degrade the input and output signal integrity,
potentially masking the MCP47FVBXX’s performance.
Careful board layout minimizes these effects and
increases the Signal-to-Noise Ratio (SNR). Multi-layer
boards utilizing a low-inductance ground plane,
isolated inputs, isolated outputs and proper decoupling
are critical to achieving the performance that the silicon
is
capable
of
providing.
Particularly
harsh
environments may require shielding of critical signals.
Separate digital and analog ground planes are
recommended. In this case, the VSS pin and the ground
pins of the VDD capacitors should be terminated to the
analog ground plane.
8.10.2.2
PCB Area Requirements
In some applications, PCB area is a criteria for device
selection. Table 8-2 shows the typical package
dimensions and area for the different package options.
Note:
Breadboards and wire-wrapped boards
are not recommended.
TABLE 8-2:
PACKAGE FOOTPRINT(1)
Package
Package Footprint
Type
Code
Dimensions
(mm)
Area (mm2)
Length Width
8
TSSOP
ST
3.00
4.40
13.20
Note 1:
Does not include recommended land
pattern dimensions. Dimensions are
typical values.



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