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ADPD105BCPZ bảng dữ liệu(PDF) 12 Page - Analog Devices

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ADPD105BCPZ bảng dữ liệu(HTML) 12 Page - Analog Devices

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ADPD105/ADPD106/ADPD107
Data Sheet
Rev. A | Page 12 of 66
ABSOLUTE MAXIMUM RATINGS
Table 8.
Parameter
Rating
AVDD to AGND
−0.3 V to +2.2 V
DVDD to DGND
−0.3 V to +2.2 V
GPIO0 to DGND
−0.3 V to +2.2 V
GPIO1 to DGND
−0.3 V to +2.2 V
LEDXx to LGND
−0.3 V to +3.6 V
SCL to DGND
−0.3 V to +3.9 V
SDA to DGND
−0.3 V to +3.9 V
Junction Temperature
150°C
ESD
Human Body Model (HBM)
1500 V
Charged Device Model (CDM)
500 V
Machine Model (MM)
100 V
Stresses at or above those listed under Absolute Maximum
Ratings may cause permanent damage to the product. This is a
stress rating only; functional operation of the product at these
or any other conditions above those indicated in the operational
section of this specification is not implied. Operation beyond
the maximum operating conditions for extended periods may
affect product reliability.
THERMAL RESISTANCE
Thermal performance is directly linked to printed circuit board
(PCB) design and operating environment. Close attention to
PCB thermal design is required.
Table 9. Thermal Resistance
Package Type
θJA
Unit
CP-28-5
54.9
°C/W
CB-16-18
60
°C/W
CB-17-1
60
°C/W
RECOMMENDED SOLDERING PROFILE
Figure 5 and Table 10 provide details about the recommended
soldering profile.
tP
tL
t25°C TO PEAK
tS
PREHEAT
CRITICAL ZONE
TL TO TP
TIME
RAMP-DOWN
RAMP-UP
TSMIN
TSMAX
TP
TL
Figure 5. Recommended Soldering Profile
Table 10. Recommended Soldering Profile
Profile Feature
Condition (Pb-Free)
Average Ramp Rate (TL to TP)
3°C/sec max
Preheat
Minimum Temperature (TSMIN)
150°C
Maximum Temperature (TSMAX)
200°C
Time (TSMIN to TSMAX) (tS)
60 sec to 180 sec
TSMAX to TL Ramp-Up Rate
3°C/sec maximum
Time Maintained Above Liquidous
Temperature
Liquidous Temperature (TL)
217°C
Time (tL)
60 sec to 150 sec
Peak Temperature (TP)
+260 (+0/−5)°C
Time Within 5°C of Actual Peak
Temperature (tP)
<30 sec
Ramp-Down Rate
6°C/sec maximum
Time from 25°C to Peak Temperature
8 minutes maximum
ESD CAUTION



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