VSC8221 datasheet(9/138 Pages) MICROSEMI

9 / 138 page

VSC8221

Data Sheet

VMDS-10106 Revision 4.1

December 2006

9 of 10

23.3.11

Register 26E (1Ah) - Reserved ..........................................................................................................104

23.3.12

Register 27E (1Bh) - Reserved ..........................................................................................................104

23.3.13

Register 28E (1Ch) - Reserved ..........................................................................................................104

23.3.14

23.3.15

Electrical Specifications ............................................................................................................................................ 107

24.1 Absolute Maximum Ratings .............................................................................................................. 107

24.2 Recommended Operating Conditions .............................................................................................. 107

24.3 Thermal Application Data ................................................................................................................. 108

24.4 Package Thermal Specifications - 100 TFBGA ................................................................................ 109

24.5 Current and Power Consumption Estimates .................................................................................... 109

DC Specifications ....................................................................................................................................................... 114

25.1 Digital Pins (VDDiO = 3.3 V) ............................................................................................................. 114

25.2 Digital Pins (VDDiO = 2.5 V) ............................................................................................................. 114

25.3 LED Output Pins (LED[2:0]) ............................................................................................................. 115

Clocking Specifications ............................................................................................................................................. 116

26.1 Reference Clock Option ................................................................................................................... 116

26.2 Crystal Option ................................................................................................................................... 116

SerDes Specifications ................................................................................................................................................ 117

System Timing Specifications .................................................................................................................................. 118

28.1 JTAG Timing ..................................................................................................................................... 118

28.2 SMi Timing ........................................................................................................................................ 119

28.3 MDiNT Timing ................................................................................................................................... 120

28.4 Serial LED_CLK and LED_DATA Timing ......................................................................................... 120

28.5 REFCLK Timing ................................................................................................................................ 121

28.6 CLKOUT and CLKOUTMiCRO Timing ............................................................................................. 122

28.7 Reset Timing .................................................................................................................................... 123

Packaging Specifications .......................................................................................................................................... 124

29.1 100-Ball 9 × 9mm TFBGA Mechanical Specification ........................................................................ 124

29.2 Package Moisture Sensitivity ............................................................................................................ 124

Ordering information .................................................................................................................................................. 125

30.1 Devices ............................................................................................................................................. 125

Design Guidelines ....................................................................................................................................................... 126

31.1 Required PHY Register Write Sequence .......................................................................................... 126

31.2 interoperability with intel 82547Ei Gigabit Ethernet MAC+PHY iC ................................................... 126

31.3 SerDes Jitter ..................................................................................................................................... 126

31.4 SGMii 100BASE-TX Corruption of Packets with Odd Preambles .................................................... 127

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