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VD6640 bảng dữ liệu(PDF) 88 Page - STMicroelectronics |
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VD6640 bảng dữ liệu(HTML) 88 Page - STMicroelectronics |
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88 / 126 page ![]() Electrical characteristics VG6640, VD6640 88/126 DocID023597 Rev 11 Caution: Stresses above those listed under “Absolute maximum ratings” may cause permanent damage to the device. This is a stress rating only and functional operation of the device at these or any other conditions above those indicated in the operational sections of the specification is not implied. Exposure to absolute maximum rating conditions for extended periods may affect device reliability. 9.3 Operating conditions Table 41. Operating conditions Symbol C Parameter Minimum Typical Maximum Unit VCORE C Digital core power supply 1.08 1.2 1.32 V VDIG C Digital I/O power supply 1.62 1.8 1.92 V VANA C Analog power supply 2.66 2.8 2.94 V VIP C Digital input voltage(1) 1. Digital input: EXTCLK_XTAL1, EXTCLK_EN, XSHUTDOWN, RESET_N, FSYNC_IN, GPIO, SCL, SDA. -0.3 2.3 V TJF C Junction temperature (operating functionally) -40 +125 °C TJN PA Junction temperature (operating normally and producing acceptable images) -40 +105 °C TAO T Ambient temperature (operating optimally) +5 +40 °C TATR PA Ambient room temperature during test(2) 2. 100% tested parameters are measured at this temperature. +20 +30 °C TATH PA Ambient high temperature during wafer test(3) 3. A subset of parameters are measured at this temperature. +103 +105 °C P Ambient high temperature during wafer test(3) +58 +60 TATL PA Ambient low temperature during wafer test(3) -40 -38 °C θJA-F D Junction to ambient thermal resistance for device attached to a PCB in free air 50 °C/W θJA-H D Junction to ambient thermal resistance for device attached to a PCB on an infinite heatsink 23 °C/W |
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