HMC8364

Data Sheet

Rev. A | Page 6 of 17

PIN CONFIGURATION AND FUNCTION DESCRIPTIONS

NOTE

1. NIC = NO INTERNAL CONNECTION. HOWEVER, THESE PINS

CAN BECONNECTED TO RF OR DC GROUND WITHOUT

AFFECTING THE PERFORMANCE OF THE DEVICE.

2. EXPOSED PAD. THE PACKAGE BOTTOM HAS AN

EXPOSED METAL PAD THAT MUST BE CONNECTED

TO RF OR DC GROUND.

1

NIC

2

GND

3

NIC

4

GND

5

RFOUT

6

GND

7

NIC

8

VCB

9

NIC

10

NIC

23 VC3

24 GND

25 VC2

26 GND

28 GND

29 VC1

30 NIC

22 VC4

21 NIC

HMC8364

TOP VIEW

(Not to Scale)

Figure 2. Pin Configuration

Table 5. Pin Function Descriptions

Pin No.

Mnemonic

Description

1, 3, 7, 9 to 21, 30 to 40

NIC

No Internal Connection. However, these pins can be connected to RF or dc ground without

affecting the performance of the device.

2, 4, 6, 24, 26, 28

GND

Ground. The GND pins must be connected to RF or dc ground.

5

RFOUT

RF Output. The RFOUT pin is ac-coupled, and maintaining a voltage standing wave ratio (VSWR)

load of ≤2.0:1 across frequency is recommended.

8

VCB

Buffer Supply Voltage.

22

VC4

Band 4 Supply Voltage.

23

VC3

Band 3 Supply Voltage.

25

VC2

Band 2 Supply Voltage.

27

Control Voltage and Modulation Input. The modulation bandwidth is dependent on the drive

source impedance.

29

VC1

Band 1 Supply Voltage.

EP

Exposed Pad. The package bottom has an exposed metal pad that must be connected to RF or dc

ground.

INTERFACE SCHEMATICS

RFOUT

VCB

Figure 3. RFOUT and VCB Interface Schematic

VCx

Figure 4. VC1 to VC4 Interface Schematic

125pF

1.6Ω 0.4nH

215pF

GND

Figure 6. GND Interface Schematic